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MT8870DS

Microchip Technology

MT8870DS by Microchip Technology

MT8870DS by Microchip Technology is a DTMF signaling circuit with 18 terminals. It operates at 5V, consuming 9mA max supply current. Ideal for telecom applications, it features CMOS technology and industrial temperature grade (-40 to 85°C).

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 366 parts In-Stock

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Electronics Depot

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LIBRA Elektronik GmbH

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Pegasus Components GmbH

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Chip Stock

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ComSIT Distribution GmbH

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Nova Conductors

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J2 Sourcing AB

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Digital Electronic Gebert Verwaltungs UG

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Corel Iberica Componentes, S.L.

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Zilex Electronics Inc.

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Halfin

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LWI Electronics Inc

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ABC Electronics Ltd.

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Fibra_Brandt Electronic GMBH

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Q Components

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Goldney Electronics S.L.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Velocity Electronics

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Mil-Aero Solutions, Inc.

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MRC Electronics

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North Shore Components

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Bristol Electronics

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ECAB

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Holdelec - ElecDif-Pro

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PC Components Company LLC

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Classic Components Corporation

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Ack Elektronik San.Tic.Ltd.Sti

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Resion

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Odintec Ltd.

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Manoshevitz Elec. Sales

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Cyclops Electronics Ltd

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J & M Industries LLC

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Legend Electronics Inc.

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LittleDiode

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MISTER SPROCKETS

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Speed Components Ltd

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AZTECH Wire

Italy . 432 parts In-Stock

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$9.998

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Aztec Data Supply Inc.

USA . 249 parts In-Stock

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S.R.D Solutions

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Continental Prestige Electronics

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Kepictronics

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 2,669 parts In-Stock

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Argo Parts USA

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Cyclops Electronics Ltd (Excess)

UK . 78 parts In-Stock

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Bastille Electronics

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Overview

Enhance your telecom systems with the MT8870DS by Microchip Technology, a top-quality DTMF signaling circuit designed to provide seamless communication. This small outline package offers easy integration with surface mount capabilities, ensuring convenience and efficiency. With an industrial temperature grade and low power consumption, this IC guarantees reliability and cost-effectiveness. Upgrade your signaling capabilities today with the MT8870DS and experience the superior performance Microchip Technology is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat, making the product reliable for long-term use.

Surface Mount: YES

Ease of installation and space-saving on PCB due to surface mount capability.

Power Supplies (V): 5

Operates at a standard voltage of 5V, making it compatible with most systems.

Maximum Operating Temperature: 85 °C

Can operate in relatively high temperature environments, providing versatility in application.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the circuit.

Telecom IC Type: DTMF SIGNALING CIRCUIT

Specifically designed for DTMF signaling, ensuring accuracy and reliability in telecommunications applications.

Technical Specifications

Telecom - Signaling ICs MT8870DS attributes and parameters. Explore more Telecom - Signaling ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

Length:

11.55 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Telecom Signaling Circuits

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

MT8870DS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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