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MT41K512M16HA-125:A

Micron Technology

MT41K512M16HA-125:A by Micron Technology

Micron Technology's MT41K512M16HA-125:A is a DDR3L DRAM with 512MX16 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in a compact grid array package.

Median Price

$25.669

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$21.793

100+ parts

-

1k+ parts

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10k+ parts

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650

$21.793

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Digiode

USA . 1,319 parts In-Stock

1+ parts

$25.669

100+ parts

-

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1,319

$25.669

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Cyclops Electronics Ltd

UK . 501,898 parts In-Stock

1+ parts

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501,898

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Kruse

Germany . 36,187 parts In-Stock

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36,187

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Kruse Electronics AG

Switzerland . 22,777 parts In-Stock

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22,777

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ARCO, INC.

USA . 22,700 parts In-Stock

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22,700

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Vyrian

USA . 8,114 parts In-Stock

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8,114

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Semtec, LLC

USA . 5,124 parts In-Stock

1+ parts

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5,124

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Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

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4,000

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NAC Semi

USA . 680 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$27.430

10k+ parts

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680

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$27.430

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Elcom Components

USA . 595 parts In-Stock

1+ parts

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595

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Netsource Technology, Inc.

USA . 32 parts In-Stock

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32

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Prism Electronics

USA . 11 parts In-Stock

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11

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PC Components Company LLC

USA . 10 parts In-Stock

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10

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,572 parts In-Stock

1+ parts

$5.080

100+ parts

-

1k+ parts

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10k+ parts

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3,572

$5.080

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$5.196

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134

$5.196

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$5.719

100+ parts

$5.204

1k+ parts

$4.690

10k+ parts

-

3,000

$5.719

$5.204

$4.690

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$21.793

100+ parts

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1,000

$21.793

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Continental Prestige Electronics

USA . 470 parts In-Stock

1+ parts

$21.793

100+ parts

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1k+ parts

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10k+ parts

$21.357

470

$21.793

-

-

$21.357

Ampacity Inc.

Singapore . 1,128 parts In-Stock

1+ parts

$22.000

100+ parts

-

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1,128

$22.000

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Semicontronic

India . 1,052 parts In-Stock

1+ parts

$22.000

100+ parts

$21.450

1k+ parts

$21.340

10k+ parts

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1,052

$22.000

$21.450

$21.340

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Corphita

USA . 1,152 parts In-Stock

1+ parts

$24.318

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1,152

$24.318

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Perfect Parts

USA . 29,411 parts In-Stock

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29,411

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Kepictronics

USA . 12,000 parts In-Stock

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Argo Parts USA

USA . 3,183 parts In-Stock

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3,183

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

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2,000

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Microchip USA

USA . 1,658 parts In-Stock

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1,658

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Alle Elektronik GmbH

Germany . 900 parts In-Stock

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900

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Emar International I/E

Canada . 522 parts In-Stock

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522

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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100+ parts

$7.327

1k+ parts

$7.327

10k+ parts

$7.327

150

-

$7.327

$7.327

$7.327

iodParts Technologies Inc.

India . 80 parts In-Stock

1+ parts

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80

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Overview

Unleash the power of cutting-edge technology with Micron Technology's MT41K512M16HA-125:A. This high-quality DDR3L DRAM offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With its advanced features like synchronous operation and self-refresh capability, this memory module ensures seamless multitasking and efficient data processing. Trust Micron Technology to deliver superior products that exceed expectations, providing you with the competitive edge you need. Upgrade to the MT41K512M16HA-125:A today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient and synchronized data transfer, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 1.35

The low nominal supply voltage of 1.35V helps in reducing power consumption, making the product energy-efficient.

Memory Density: 8589934592 bit

With a high memory density of 8589934592 bits, this DRAM module offers ample storage capacity for storing large amounts of data.

Technical Specifications

DRAM MT41K512M16HA-125:A attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B96

Length:

14 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Trade Compliance

MT41K512M16HA-125:A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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