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MT41K1G8RKB-107:P

Micron Technology

MT41K1G8RKB-107:P by Micron Technology

Micron Technology's MT41K1G8RKB-107:P is a DDR3L DRAM with 1GX8 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in devices like smartphones, tablets, and laptops.

Median Price

$25.600

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,440 parts In-Stock

1+ parts

$21.420

100+ parts

-

1k+ parts

$20.590

10k+ parts

-

1,440

$21.420

-

$20.590

-

DigiKey

USA . 1,727 parts In-Stock

1+ parts

$29.780

100+ parts

$23.044

1k+ parts

$21.737

10k+ parts

-

1,727

$29.780

$23.044

$21.737

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,895 parts In-Stock

1+ parts

$20.349

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$20.349

-

-

-

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$24.000

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$31.750

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$31.750

-

-

-

IBS Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$24.990

8,000

-

-

-

$24.990

Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Sensible Micro Corp

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,653

-

-

-

-

Vyrian

USA . 1,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

-

-

-

-

PC Components Company LLC

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,599 parts In-Stock

1+ parts

$2.760

100+ parts

-

1k+ parts

-

10k+ parts

-

2,599

$2.760

-

-

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$5.666

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$5.666

-

-

-

Corphita

USA . 1,623 parts In-Stock

1+ parts

$19.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

$19.278

-

-

-

Continental Prestige Electronics

USA . 5,389 parts In-Stock

1+ parts

$31.750

100+ parts

-

1k+ parts

-

10k+ parts

$31.115

5,389

$31.750

-

-

$31.115

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$31.750

100+ parts

$30.162

1k+ parts

-

10k+ parts

$28.258

200

$31.750

$30.162

-

$28.258

CoreStaff

Japan . 1,440 parts In-Stock

1+ parts

$33.959

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

$33.959

-

-

-

Ampacity Inc.

Singapore . 1,228 parts In-Stock

1+ parts

$39.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,228

$39.630

-

-

-

iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,016

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,438

-

-

-

-

GreenTree Electronics

Israel . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Argo Parts USA

USA . 2,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

-

-

-

-

Authorized Procurement Solutions

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

-

-

-

-

Kepictronics

USA . 829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

829

-

-

-

-

Overview

Upgrade your devices with the cutting-edge MT41K1G8RKB-107:P by Micron Technology. As a leading manufacturer of DRAM, Micron ensures top-notch quality and reliability in every product. This DDR3L DRAM offers unparalleled performance, efficiency, and speed for a wide range of applications. With a nominal supply voltage of 1.35V, self-refresh capability, and dual bank page burst access mode, this memory module provides seamless operation and enhanced user experience. Trust Micron to deliver the best in memory technology, choose the MT41K1G8RKB-107:P for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design.

Operating Mode: SYNCHRONOUS

Ensures synchronized data transmission for optimum performance.

Nominal Supply Voltage / Vsup (V): 1.35

Efficient power consumption at a stable voltage level.

Organization: 1GX8

High memory organization for efficient data storage and retrieval.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Memory IC Type: DDR3L DRAM

DDR3L DRAM provides high-speed and energy-efficient performance.

Technical Specifications

DRAM MT41K1G8RKB-107:P attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

DUAL BANK PAGE BURST

Additional Features:

SELF REFRESH

JESD-30 Code:

R-PBGA-B78

JESD-609 Code:

e1

Length:

10.5 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K1G8RKB-107:P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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