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MT41K128M16JT-125AAT:K

Micron Technology

MT41K128M16JT-125AAT:K by Micron Technology

Micron Technology's MT41K128M16JT-125AAT:K is a DDR3L DRAM with 128MX16 organization, operating at 800 MHz. It features a thin profile grid array package, operates at 1.35V, and has an industrial temperature grade. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.

Median Price

$8.776

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 28 parts In-Stock

1+ parts

$14.060

100+ parts

$12.039

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$11.350

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28

$14.060

$12.039

$11.350

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Mouser Electronics

USA . 1,054 parts In-Stock

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$23.550

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$23.550

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Newark

USA . 68 parts In-Stock

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$41.310

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68

$41.310

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Arrow

USA . 16,000 parts In-Stock

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$3.492

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Verical

USA . 16,000 parts In-Stock

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$3.492

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Future Electronics

Canada . 6,120 parts In-Stock

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$3.140

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6,120

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$3.140

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Distributors (In-Stock)

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Flip Electronics

USA . 787 parts In-Stock

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$4.180

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787

$4.180

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Ozdisan Elektronik

Türkiye . 623 parts In-Stock

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$4.299

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623

$4.299

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Digiode

USA . 1,036 parts In-Stock

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$5.909

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1,036

$5.909

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Nova Conductors

Japan . 300 parts In-Stock

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$8.105

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$8.105

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NAC Semi

USA . 388,008 parts In-Stock

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$4.290

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ComSIT Distribution GmbH

Germany . 45,000 parts In-Stock

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Vyrian

USA . 20,608 parts In-Stock

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Cyclops Electronics Ltd

UK . 16,112 parts In-Stock

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Chip Stock

USA . 10,800 parts In-Stock

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Sensible Micro Corp

USA . 2,789 parts In-Stock

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2,789

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Rebound Electronics

UK . 2,000 parts In-Stock

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2,000

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IBS Electronics

USA . 1,200 parts In-Stock

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$198.314

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Atlantic Semiconductor

USA . 500 parts In-Stock

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500

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LIBRA Elektronik GmbH

Germany . 29 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 20,885 parts In-Stock

1+ parts

$2.970

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20,885

$2.970

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Semicontronic

India . 4,709 parts In-Stock

1+ parts

$2.970

100+ parts

$2.896

1k+ parts

$2.881

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4,709

$2.970

$2.896

$2.881

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Component Stockers USA

USA . 15,850 parts In-Stock

1+ parts

$3.380

100+ parts

$3.220

1k+ parts

$3.110

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15,850

$3.380

$3.220

$3.110

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Aztec Data Supply Inc.

USA . 4,918 parts In-Stock

1+ parts

$3.605

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$3.605

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Corohmni

South Africa . 25 parts In-Stock

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$4.125

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25

$4.125

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Corphita

USA . 556 parts In-Stock

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$5.598

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556

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Continental Prestige Electronics

USA . 6,028 parts In-Stock

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$7.650

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$7.497

6,028

$7.650

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$7.497

Netroflash

USA . 500 parts In-Stock

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$8.105

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$7.943

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$8.105

$7.943

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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Perfect Parts

USA . 12,949 parts In-Stock

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RC Electronics

USA . 6,530 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,324 parts In-Stock

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Argo Parts USA

USA . 2,142 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Microchip USA

USA . 1,580 parts In-Stock

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1,580

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Speed Components Ltd (Excess)

Israel . 1,224 parts In-Stock

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Authorized Procurement Solutions

USA . 1,068 parts In-Stock

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Infinite Electronics LLP (Excess)

. 906 parts In-Stock

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S.R.D Solutions

India . 600 parts In-Stock

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Kepictronics

USA . 311 parts In-Stock

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Overview

Elevate your system's performance with the MT41K128M16JT-125AAT:K by Micron Technology. This top-tier DDR3L DRAM offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With a focus on power efficiency and high-speed data processing, this memory module delivers exceptional value to customers looking to optimize their devices. Trust in Micron Technology to provide cutting-edge technology that exceeds expectations. Experience the difference with the MT41K128M16JT-125AAT:K.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DRAM, ensuring reliable performance in various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination between the DRAM and the system, improving overall performance.

Nominal Supply Voltage / Vsup (V): 1.35

The low nominal supply voltage helps in reducing power consumption, making the DRAM more energy-efficient.

Maximum Clock Frequency (fCLK): 800 MHz

The high clock frequency allows for faster data transfer and processing, enhancing the speed and efficiency of the DRAM.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DRAM a reliable and efficient choice.

Memory IC Type: DDR3L DRAM

DDR3L DRAM provides high bandwidth and improved performance compared to older DRAM types, making it ideal for demanding applications.

Technical Specifications

DRAM MT41K128M16JT-125AAT:K attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.35

Qualification:

Not Qualified

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

MT41K128M16JT-125AAT:K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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