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LX5584BLQ-TR

Microchip Technology

LX5584BLQ-TR by Microchip Technology

LX5584BLQ-TR by Microchip Technology is a Cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for cellphone applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,319 parts In-Stock

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7,319

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Nova Conductors

Japan . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$11.800

100+ parts

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712

$11.800

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

1+ parts

$373.000

100+ parts

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1,358

$373.000

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Lixinc

USA . 18,365 parts In-Stock

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18,365

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West Coast Incorporated

USA . 1,220 parts In-Stock

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1,220

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience the superior quality and reliability of Microchip Technology with the LX5584BLQ-TR, a cutting-edge Cellphone IC designed to enhance performance and efficiency. This surface-mount device boasts a compact square package shape with 16 terminals, making it ideal for a wide range of applications. With an industrial temperature grade and advanced RF and baseband circuit technology, this product ensures optimal functionality in challenging environments. Trust Microchip Technology to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Provides a compact and uniform design, optimizing space utilization within electronic devices.

No. of Terminals: 16

Offers ample connectivity options for various functions, enhancing versatility and flexibility in usage.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLOG

Ensures effective heat dissipation and protection, improving reliability and longevity of the product.

Maximum Operating Temperature: 85 °C

Supports stable performance even under high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Enables reliable operation in cold conditions, adding to the product's durability and resilience.

Terminal Position: QUAD

Facilitates easy identification and connection of terminals, simplifying integration into electronic systems.

Maximum Seated Height: 1.023 mm

Offers a low profile design, allowing for greater flexibility in device placement and design.

Width: 3 mm

Contributes to a small form factor, enabling the product to be used in compact electronic devices.

Length: 3 mm

Further enhances the product's compactness, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Indicates high reliability and durability, meeting the stringent requirements of industrial applications.

Terminal Form: NO LEAD

Improves soldering efficiency and reliability, ensuring secure connections for optimal performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Provides advanced functionality for communication devices, enhancing performance and connectivity.

Nominal Supply Voltage: 5 V

Supports compatibility with various power sources, making the product versatile and widely applicable.

Terminal Pitch: 0.5 mm

Offers precise and space-saving terminal spacing, allowing for efficient PCB layout and design.

Technical Specifications

Cellphone ICs LX5584BLQ-TR attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Maximum Seated Height:

1.023 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

LX5584BLQ-TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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