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USB5807/KD

Microchip Technology

USB5807/KD by Microchip Technology

USB5807/KD by Microchip Technology is a BUS CONTROLLER with 625 MBps data transfer rate, suitable for I2C, SMBUS, and SPI buses. Operating at 0-70 °C, it has a supply voltage range of 1.08-1.32 V and supports up to 25 MHz clock frequency. Ideal for applications requiring high-speed USB connectivity in compact designs.

Median Price

$8.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 12 parts In-Stock

1+ parts

$1.467

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$1.467

-

-

-

TME

Poland . 4 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$8.000

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$8.970

-

-

-

Vyrian

USA . 10,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$8.791

100+ parts

-

1k+ parts

$8.439

10k+ parts

-

100

$8.791

-

$8.439

-

Aztec Data Supply Inc.

USA . 54 parts In-Stock

1+ parts

$10.305

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$10.305

-

-

-

Corohmni

South Africa . 1,170 parts In-Stock

1+ parts

$10.515

100+ parts

-

1k+ parts

-

10k+ parts

-

1,170

$10.515

-

-

-

AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$15.593

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$15.593

-

-

-

Ampacity Inc.

Singapore . 477 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

-

10k+ parts

-

477

$35.000

-

-

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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90,000

-

-

-

-

RGB Technical Solutions

Ukraine . 6,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,102

-

-

-

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Lixinc

USA . 3,762 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,762

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-

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Microchip USA

USA . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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295

-

-

-

-

Overview

Experience seamless and efficient data transfer with the USB5807/KD by Microchip Technology, a leading manufacturer known for its high-quality products. As a Bus Controller with a maximum data transfer rate of 625 MBps, this device offers unmatched performance and reliability. Whether you need to connect I2C, SMBUS, or SPI peripherals, this chip carrier is the perfect solution. With its very thin profile and robust construction, the USB5807/KD ensures optimal functionality in various applications. Upgrade your system today and enjoy the benefits of faster data exchange and enhanced connectivity.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with a variety of systems.

Screening Level: TS 16949

TS 16949 certification ensures high quality and reliability in manufacturing processes, making this product a trustworthy choice for critical applications.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables fast communication with connected devices, ideal for applications requiring quick data exchange.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus controller efficient and reliable in various environments.

Technical Specifications

Bus Controllers USB5807/KD attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; SMBUS; SPI

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-XQCC-N100

JESD-609 Code:

e3

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB5807/KD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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