Loading...

PM5337-FEI

Microchip Technology

PM5337-FEI by Microchip Technology

PM5337-FEI by Microchip Technology is a 896-terminal ATM/SONET/SDH MUX/DEMUX IC in a plastic square package with grid array style. It is surface mountable and features ball terminals at the bottom. Ideal for telecom applications requiring high-speed data transmission.

Median Price

$199.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,187 parts In-Stock

1+ parts

$199.740

100+ parts

$151.320

1k+ parts

-

10k+ parts

-

2,187

$199.740

$151.320

-

-

DigiKey

USA . 26 parts In-Stock

1+ parts

$199.740

100+ parts

$166.411

1k+ parts

-

10k+ parts

-

26

$199.740

$166.411

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 27 parts In-Stock

1+ parts

$145.267

100+ parts

$119.119

1k+ parts

-

10k+ parts

-

27

$145.267

$119.119

-

-

Vyrian

USA . 6,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,539

-

-

-

-

Dan-Mar Components

USA . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,558 parts In-Stock

1+ parts

$169.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$169.780

-

-

-

Authorized Procurement Solutions

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70,000

-

-

-

-

Lixinc

USA . 11,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,864

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Fulton Briggs Corp.

USA . 1,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,001

-

-

-

-

Perfect Parts

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Overview

The PM5337-FEI by Microchip Technology is a top-of-the-line ATM/SONET/SDH circuit designed to provide high-quality performance in telecom applications. With its advanced technology and durable plastic/epoxy package, this product offers unparalleled reliability and efficiency. Whether you're looking to enhance network connectivity or streamline data transmission, the PM5337-FEI is the perfect solution for your needs. Trust Microchip Technology to deliver cutting-edge products that exceed expectations and elevate your business to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective, making it easy to handle and install.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and improving overall product reliability.

Package Shape: SQUARE

The square package shape ensures consistent and efficient use of space, making it ideal for densely populated circuit boards.

No. of Terminals: 896

With a high number of terminals, this product can handle complex connections and data transmission requirements, making it suitable for advanced ATM/SONET/SDH applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides enhanced connectivity and reliability, ensuring stable performance in high-speed networking environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and improves thermal performance, promoting efficient heat dissipation.

Terminal Form: BALL

The ball terminal form enhances electrical connections and signal integrity, reducing signal loss and ensuring high data transmission speeds.

Telecom IC Type: ATM/SONET/SDH MUX/DEMUX

The telecom IC type indicates that this product is specifically designed for multiplexing and demultiplexing functions in ATM/SONET/SDH networks, making it a reliable and specialized choice for telecom applications.

Technical Specifications

ATM/SONET/SDH Circuits PM5337-FEI attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B896

No. of Functions:

1

No. of Terminals:

896

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5337-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20