Loading...

PM5336B-FEI

Microchip Technology

PM5336B-FEI by Microchip Technology

PM5336B-FEI by Microchip Technology is a 1152-terminal ATM/SONET/SDH MUX/DEMUX IC in a plastic grid array package. It features surface mount capability, square shape, and ball terminals at the bottom. Ideal for telecom applications requiring high-density circuit integration.

Median Price

$1,112.710

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,488 parts In-Stock

1+ parts

$1,112.710

100+ parts

$842.950

1k+ parts

-

10k+ parts

-

1,488

$1,112.710

$842.950

-

-

DigiKey

USA . 24 parts In-Stock

1+ parts

$1,112.710

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$1,112.710

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Fulton Briggs Corp.

USA . 3,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,791

-

-

-

-

Lixinc

USA . 3,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,651

-

-

-

-

Overview

Unlock unparalleled networking performance with the PM5336B-FEI by Microchip Technology. This cutting-edge ATM/SONET/SDH circuit boasts top-notch quality and reliability, backed by Microchip's stellar reputation in the industry. Ideal for a wide range of telecom applications, this product offers unmatched value and benefits to customers seeking seamless connectivity and enhanced network efficiency. Upgrade your network infrastructure today with the PM5336B-FEI and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount feature allows for easy installation and maintenance, saving time and effort during setup.

Package Shape: SQUARE

Square package shape enhances space efficiency and allows for easy integration into existing systems or setups.

No. of Terminals: 1152

Large number of terminals provide flexibility and support for complex connections, enabling the product to handle multiple data streams efficiently.

Package Style (Meter): GRID ARRAY

Grid array package style offers a high-density layout, enabling the product to accommodate a large number of components in a compact design.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection with other devices or components, ensuring a secure and stable electrical connection.

Terminal Form: BALL

Ball terminal form enhances electrical conductivity and ensures reliable signal transmission, contributing to the overall performance and functionality of the product.

Telecom IC Type: ATM/SONET/SDH MUX/DEMUX

ATM/SONET/SDH MUX/DEMUX telecom IC type indicates that the product is designed for high-speed data processing, making it ideal for applications requiring fast and efficient communication.

Technical Specifications

ATM/SONET/SDH Circuits PM5336B-FEI attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B1152

No. of Functions:

1

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5336B-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.