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PM5309-FEI

Microchip Technology

PM5309-FEI by Microchip Technology

PM5309-FEI by Microchip Technology is an ATM/SONET/SDH circuit with 500 terminals in a square grid array package. It operates at a nominal voltage of 1.2V and supports telecom applications. The package body material is plastic/epoxy, making it suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,801

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-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$17.430

100+ parts

-

1k+ parts

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10k+ parts

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964

$17.430

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Ampacity Inc.

Singapore . 216 parts In-Stock

1+ parts

$110.640

100+ parts

-

1k+ parts

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10k+ parts

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216

$110.640

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Lixinc

USA . 9,309 parts In-Stock

1+ parts

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9,309

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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RGB Technical Solutions

Ukraine . 901 parts In-Stock

1+ parts

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901

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Overview

The PM5309-FEI by Microchip Technology is the ultimate solution for all your ATM/SONET/SDH circuit needs. With a reputation for unparalleled quality and reliability, Microchip Technology delivers cutting-edge technology in a sleek package that offers 500 terminals in a grid array style. Whether you're in telecommunications or network infrastructure, this product provides unmatched value and performance. Experience the benefits of seamless connectivity and superior functionality with the PM5309-FEI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring longevity and ease of handling during installation.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into circuit boards, reducing assembly time and allowing for more compact designs.

Package Shape: SQUARE

The square shape of the package provides a more uniform and compact footprint, optimizing space utilization and making it suitable for densely populated circuit boards.

No. of Terminals: 500

The high number of terminals allows for more connectivity options and flexibility in design, accommodating complex circuit configurations and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance, improved electrical performance, and enhanced reliability, making it ideal for high-speed and high-frequency applications like ATM/SONET/SDH circuits.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier and more stable connections to the circuit board, reducing signal interference and ensuring better overall performance.

Terminal Form: BALL

The ball terminal form provides better electrical conductivity, mechanical strength, and reliability, ensuring secure connections and signal integrity in demanding telecom applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Being designed specifically for ATM/SONET/SDH support circuits, this product offers optimized performance, compatibility, and functionality for telecommunications networks, ensuring reliable data transmission and network efficiency.

Nominal Supply Voltage: 1.2 V

Operating at a low supply voltage of 1.2 V, this product offers energy efficiency, reduced power consumption, and compatibility with low-voltage circuitry, making it suitable for modern telecom systems that prioritize power conservation and sustainability.

Technical Specifications

ATM/SONET/SDH Circuits PM5309-FEI attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B500

No. of Functions:

1

No. of Terminals:

500

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5309-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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