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PM5377-FEI

Microchip Technology

PM5377-FEI by Microchip Technology

PM5377-FEI by Microchip Technology is a telecom IC supporting ATM/SONET/SDH circuits. It operates at 1.2V nominal voltage and features 1152 terminals in a square grid array package for surface mount applications. Ideal for high-speed networking equipment requiring advanced circuit support.

Median Price

$873.190

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 288 parts In-Stock

1+ parts

$672.650

100+ parts

$632.290

1k+ parts

$591.930

10k+ parts

-

288

$672.650

$632.290

$591.930

-

Microchip Technology

USA . 360 parts In-Stock

1+ parts

$873.190

100+ parts

$661.570

1k+ parts

-

10k+ parts

-

360

$873.190

$661.570

-

-

DigiKey

USA . 24 parts In-Stock

1+ parts

$873.190

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$873.190

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Fulton Briggs Corp.

USA . 1,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,149

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock the power of reliable and high-quality telecommunications with the PM5377-FEI by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch performance and durability in all their products. The PM5377-FEI falls under the category of ATM/SONET/SDH Circuits, offering seamless connectivity and efficient data transmission. With 1152 terminals and a grid array package style, this Telecom IC type provides unmatched value for your communication needs. Trust Microchip Technology to deliver excellence in every aspect of your networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, perfect for use in telecommunications equipment.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in assembly.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board.

No. of Terminals: 1152

Having a high number of terminals allows for multiple connections, making the product versatile and capable of handling complex circuit designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high-density interconnection capability, making it ideal for use in telecommunications applications where space is limited.

Terminal Position: BOTTOM

Having terminals at the bottom makes it easier to connect the product to the circuit board, improving overall reliability and performance.

Terminal Form: BALL

The ball terminal form ensures a secure connection, reducing the risk of signal loss or interference.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

This circuit type is specifically designed for ATM, SONET, and SDH applications, making it a reliable choice for telecommunications equipment.

Nominal Supply Voltage: 1.2 V

Operating at a low supply voltage of 1.2V helps to minimize power consumption and heat generation, making the product energy-efficient and suitable for use in various devices.

Technical Specifications

ATM/SONET/SDH Circuits PM5377-FEI attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B1152

No. of Functions:

1

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5377-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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