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MCP25055T-I/SL

Microchip Technology

MCP25055T-I/SL by Microchip Technology

MCP25055T-I/SL by Microchip: 8-bit peripheral IC with 3-5V power supplies, CMOS technology. Ideal for industrial applications, TS16949 screening level, operates b/w -40 to 85°C. Small outline package with dual terminals and matte tin finish.

Median Price

$7.054

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$7.054

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38

$7.054

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Vyrian

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,797 parts In-Stock

1+ parts

$3.730

100+ parts

-

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1,797

$3.730

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$6.913

100+ parts

-

1k+ parts

$6.637

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50

$6.913

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$6.637

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Continental Prestige Electronics

USA . 2,290 parts In-Stock

1+ parts

$7.054

100+ parts

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$6.913

2,290

$7.054

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$6.913

AZTECH Wire

Italy . 566 parts In-Stock

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$10.835

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566

$10.835

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Aztec Data Supply Inc.

USA . 1,803 parts In-Stock

1+ parts

$23.920

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1,803

$23.920

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Corohmni

South Africa . 3,094 parts In-Stock

1+ parts

$29.621

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3,094

$29.621

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Ampacity Inc.

Singapore . 426 parts In-Stock

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$32.000

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426

$32.000

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Fulton Briggs Corp.

USA . 8,176 parts In-Stock

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8,176

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Argo Parts USA

USA . 4,983 parts In-Stock

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Overview

Enhance your electronic projects with the MCP25055T-I/SL by Microchip Technology, a high-quality Peripheral IC that delivers exceptional performance and reliability. Manufactured with precision and expertise, this product offers value by providing seamless integration and efficiency in a wide range of applications. From automotive to industrial settings, the MCP25055T-I/SL ensures optimal functionality and ease of use, making it the ideal choice for customers seeking top-tier solutions for their projects. Upgrade your designs today with the unmatched benefits and advantages of the MCP25055T-I/SL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle power surges and fluctuations, ensuring reliability in various operating conditions.

Screening Level: TS 16949

The TS 16949 screening level indicates that the product has passed stringent quality control measures, guaranteeing high performance and reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving valuable space on the circuit board for a more efficient layout.

No. of Bits: 8

The 8-bit processing capability allows for efficient data processing, making the product suitable for a wide range of applications.

Power Supplies (V): 3/5

The availability of multiple power supply options (3V and 5V) offers flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 14

With 14 terminals, this product enables seamless connectivity with other components, enhancing overall system functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and improves airflow, reducing the risk of overheating and increasing component longevity.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures optimal performance even in low-power situations, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the product to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40°C to 85°C) ensures reliable operation in extreme conditions, making the product suitable for a variety of applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent corrosion resistance, extending the product's lifespan in harsh environments.

Terminal Position: DUAL

The dual terminal position facilitates easy and secure connections, reducing the risk of loose connections or signal interference.

Maximum Seated Height: 1.75 mm

The low maximum seated height profile allows for a slim and compact design, ideal for space-constrained applications.

Width: 3.9 mm

The slim width of 3.9mm enables efficient placement on the circuit board, optimizing space utilization and allowing for a tidy layout.

Length: 8.65 mm

The compact length of 8.65mm ensures a space-saving design, ideal for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh industrial environments, making the product suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit enhances processing capabilities, making the product suitable for advanced electronic systems.

Technology: CMOS

The CMOS technology used in the product enables low power consumption and high-speed operation, enhancing energy efficiency and performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of installation, ensuring reliable performance in various applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making the product versatile and easy to integrate.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, reducing the risk of signal loss or interference.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCP25055T-I/SL attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

MCP25055T-I/SL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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