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DSPIC33FJ64GS606-50I/MR

Microchip Technology

DSPIC33FJ64GS606-50I/MR by Microchip Technology

DSPIC33FJ64GS606-50I/MR by Microchip Technology is a 16-bit DSP with 3.3V supply, 50MHz clock speed, and 9216 RAM words. Ideal for industrial applications requiring high-speed processing, it features DAC and ADC channels, along with low power mode for efficient operation. With 58 I/O lines and multiple timers, this CMOS technology-based chip offers versatile digital signal processing capabilities.

Median Price

$7.220

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$7.220

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700

$7.220

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Vyrian

USA . 6,713 parts In-Stock

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6,713

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Greenchips

USA . 16 parts In-Stock

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16

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SIE Connect GmbH - GreenChips

Germany . 16 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,059 parts In-Stock

1+ parts

$7.220

100+ parts

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10k+ parts

$7.076

2,059

$7.220

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$7.076

AZTECH Wire

Italy . 227 parts In-Stock

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$8.481

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227

$8.481

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Semicontronic

India . 190 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

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$15.520

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190

$16.000

$15.600

$15.520

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Ampacity Inc.

Singapore . 1,009 parts In-Stock

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$32.000

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1,009

$32.000

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Corohmni

South Africa . 284 parts In-Stock

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$72.870

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284

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RGB Technical Solutions

Ukraine . 4,284 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$7.076

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$6.859

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$6.715

1,000

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$6.859

$6.715

Argo Parts USA

USA . 501 parts In-Stock

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Overview

Experience the cutting-edge technology of the DSPIC33FJ64GS606-50I/MR by Microchip Technology, a top-tier manufacturer in the field of Digital Signal Processors. Designed for high-performance applications, this product offers unparalleled value with its advanced features and reliable performance. Whether you're working on industrial automation, robotics, or power electronics, this versatile DSP will elevate your projects to new heights. Trust Microchip Technology to provide you with the quality and innovation you need to succeed. Elevate your projects with the DSPIC33FJ64GS606-50I/MR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within the specified voltage range.

Bit Size: 16

Offers higher processing capabilities and precision in handling digital signals.

ADC Channels: YES

Ability to convert analog signals into digital data for processing, expanding the functionality of the DSP.

DMA Channels: YES

Allows for efficient data transfer between peripherals and memory, enhancing overall system performance.

ROM Programmability: FLASH

Enables easy and flexible reprogramming of the read-only memory, essential for firmware updates and customization.

Maximum Clock Frequency: 50 MHz

Supports high-speed processing of signals, making the DSP suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature range, ensuring stability under harsh environmental conditions.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

No. of I/O Lines: 58

Provides ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS606-50I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

58

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

9216

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Trade Compliance

DSPIC33FJ64GS606-50I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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