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DSPIC33FJ32MC101T-I/SS

Microchip Technology

DSPIC33FJ32MC101T-I/SS by Microchip Technology

DSPIC33FJ32MC101T-I/SS by Microchip is a 16-bit DSP with max clock freq of 32MHz. It operates b/w -40 to 85°C, ideal for industrial applications. With flash ROM programmability and CMOS technology, it's suitable for digital signal processing tasks in various industries.

Median Price

$3.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,800 parts In-Stock

1+ parts

$3.160

100+ parts

$2.620

1k+ parts

$2.420

10k+ parts

$2.290

4,800

$3.160

$2.620

$2.420

$2.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 3,200 parts In-Stock

1+ parts

$3.280

100+ parts

$2.970

1k+ parts

$2.720

10k+ parts

-

3,200

$3.280

$2.970

$2.720

-

Chip Stock

USA . 200,000 parts In-Stock

1+ parts

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J2 Sourcing AB

Sweden . 200,000 parts In-Stock

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Martec Srl

Italy . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 2,999 parts In-Stock

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2,999

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Nova Conductors

Japan . 35 parts In-Stock

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35

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Distributors (Availability)

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$8.430

100+ parts

-

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500

$8.430

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Microchip USA

USA . 7,395 parts In-Stock

1+ parts

$18.291

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7,395

$18.291

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Corohmni

South Africa . 795 parts In-Stock

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$20.219

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795

$20.219

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Aztec Data Supply Inc.

USA . 430 parts In-Stock

1+ parts

$57.218

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430

$57.218

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GreenTree Electronics

Israel . 200,000 parts In-Stock

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Authorized Procurement Solutions

USA . 11,861 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,678 parts In-Stock

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RGB Technical Solutions

Ukraine . 6,901 parts In-Stock

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Lixinc

USA . 3,691 parts In-Stock

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3,691

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Argo Parts USA

USA . 3,261 parts In-Stock

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Continental Prestige Electronics

USA . 1,306 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of digital signal processing with the DSPIC33FJ32MC101T-I/SS by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality products that are trusted by professionals worldwide. This digital signal processor is perfect for a wide range of applications, offering unparalleled performance and reliability. Experience the value and benefits of this product firsthand, and see how it can take your projects to the next level. Choose Microchip Technology for cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring reliability in various operating conditions.

Surface Mount: YES

Ease of installation and smaller footprint on the PCB, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

Capability to handle higher voltage inputs without risking damage to the processor.

Package Shape: RECTANGULAR

Standard shape that is easy to handle and integrate into existing designs.

Bit Size: 16

Higher bit size allows for more complex processing and calculations, suitable for demanding applications.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable operation even in harsh industrial environments.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing of data, ideal for real-time signal processing tasks.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updates and customization of the firmware, improving flexibility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ32MC101T-I/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Trade Compliance

DSPIC33FJ32MC101T-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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