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DSPIC33FJ256MC510A-E/PT

Microchip Technology

DSPIC33FJ256MC510A-E/PT by Microchip Technology

DSPIC33FJ256MC510A-E/PT by Microchip is a 16-bit DSP with 3.3V supply, 40MHz clock frequency, and 16384 RAM words. Ideal for automotive applications, it features 11 timers, 8 DMA channels, and Flash ROM programmability. With low power mode and barrel shifter, it offers high performance in a compact package.

Median Price

$8.759

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$8.759

100+ parts

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500

$8.759

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Vyrian

USA . 2,987 parts In-Stock

1+ parts

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2,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,618 parts In-Stock

1+ parts

$2.000

100+ parts

-

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1,618

$2.000

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Continental Prestige Electronics

USA . 907 parts In-Stock

1+ parts

$8.759

100+ parts

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1k+ parts

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10k+ parts

$8.584

907

$8.759

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-

$8.584

AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$9.741

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511

$9.741

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Microchip USA

USA . 2,306 parts In-Stock

1+ parts

$25.402

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2,306

$25.402

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Corohmni

South Africa . 699 parts In-Stock

1+ parts

$68.997

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699

$68.997

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Lixinc

USA . 7,840 parts In-Stock

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7,840

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RGB Technical Solutions

Ukraine . 5,326 parts In-Stock

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5,326

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Argo Parts USA

USA . 3,165 parts In-Stock

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3,165

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Overview

Unleash the power of innovation with the DSPIC33FJ256MC510A-E/PT by Microchip Technology. As a leading manufacturer in the industry, Microchip brings you a top-of-the-line Digital Signal Processor that offers unmatched performance and reliability. Ideal for a wide range of applications, this cutting-edge product delivers exceptional value and benefits to customers looking for high-quality solutions. With features like flash ROM programmability, low power mode, and multiple DMA channels, the DSPIC33FJ256MC510A-E/PT is the perfect choice for your next project. Experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for harsh environments.

Maximum Supply Voltage: 3.6 V

Allows for versatility in power supply options.

Bit Size: 16

Offers high processing capabilities and precision.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature conditions.

ADC Channels: YES

Enables analog-to-digital conversion for signal processing applications.

DMA Channels: YES

Supports direct memory access for efficient data transfer.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality for versatile applications.

No. of Timers: 11

Provides multiple timing options for scheduling tasks and operations.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

PWM Channels: YES

Supports pulse-width modulation for precise control in various applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ256MC510A-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33FJ256MC510A-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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