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DSPIC33FJ12GP202-I/ML

Microchip Technology

DSPIC33FJ12GP202-I/ML by Microchip Technology

DSPIC33FJ12GP202-I/ML by Microchip is a 16-bit DSP with max clock freq of 40 MHz, operating temp range -40 to 85 °C. Ideal for industrial applications, it features flash ROM programmability, operates at 3.3V supply voltage, and has a compact square package style.

Median Price

$4.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,891 parts In-Stock

1+ parts

$4.380

100+ parts

$3.630

1k+ parts

$3.340

10k+ parts

$3.180

1,891

$4.380

$3.630

$3.340

$3.180

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$4.380

100+ parts

$3.630

1k+ parts

$3.620

10k+ parts

-

183

$4.380

$3.630

$3.620

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DigiKey

USA . 165 parts In-Stock

1+ parts

$4.380

100+ parts

$3.630

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165

$4.380

$3.630

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,586 parts In-Stock

1+ parts

$4.530

100+ parts

$4.110

1k+ parts

$3.760

10k+ parts

-

1,586

$4.530

$4.110

$3.760

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Vyrian

USA . 6,983 parts In-Stock

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6,983

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LIBRA Elektronik GmbH

Germany . 33 parts In-Stock

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33

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 163 parts In-Stock

1+ parts

$3.720

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163

$3.720

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XL Components Corporation

Australia . 7,917 parts In-Stock

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7,917

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Marpe Global Electronics

Taiwan . 5,367 parts In-Stock

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5,367

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QualityLine Systems

Poland . 4,037 parts In-Stock

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4,037

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 423 parts In-Stock

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423

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Overview

Elevate your digital signal processing capabilities with the DSPIC33FJ12GP202-I/ML by Microchip Technology. Designed for industrial applications, this powerful 16-bit DSP offers high performance and reliability. With a maximum clock frequency of 40 MHz and flash ROM programmability, this chip delivers unparalleled speed and flexibility. Whether you're working on control systems or data acquisition, the DSPIC33FJ12GP202-I/ML is the perfect choice for demanding projects. Trust in Microchip Technology's reputation for quality and innovation, and unlock the full potential of your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for different power supply setups.

Package Shape: SQUARE

Optimal shape for efficient placement on circuit boards and space-saving design.

Bit Size: 16

Provides sufficient processing power for handling complex digital signals and calculations.

Power Supplies (V): 3.3

Compatible with common power supply standards, ensuring ease of integration.

No. of Terminals: 28

Plenty of connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Efficient design for heat dissipation and space-saving in compact electronic devices.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels without compromising performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in sub-zero temperature conditions, providing versatility in usage.

Terminal Finish: MATTE TIN

Ensures good electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Arrangement of terminals that facilitates easy connections and wiring on the PCB.

Maximum Seated Height: 1 mm

Low profile design for fitting into slim devices and space-constrained applications.

Width: 6 mm

Compact form factor for efficient placement on the circuit board.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing of digital signals and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for efficient assembly onto PCBs.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering process without damage to the components.

Length: 6 mm

Compact size for easy integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for use in demanding industrial environments due to its temperature tolerance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Multipurpose device capable of both digital signal processing and control functions.

Technology: CMOS

Efficient chip technology for low power consumption and high speed performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Maximum Supply Current: 90 mA

Low maximum supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and reliable operation.

ROM Programmability: FLASH

Allows for in-system programming and flexibility in changing software configurations.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact layout on PCB and high-density integration.

Format: FLOATING POINT

Supports floating-point arithmetic for precise calculations in digital signal processing tasks.

On Chip Program ROM Width: 24

Ample ROM width for storing program instructions and data in the chip itself.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ12GP202-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33FJ12GP202-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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