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DSPIC33FJ128GP706AT-I/MR

Microchip Technology

DSPIC33FJ128GP706AT-I/MR by Microchip Technology

DSPIC33FJ128GP706AT-I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications, it features flash ROM programmability, CMOS technology, and operates at a nominal voltage of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,176 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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AZTECH Wire

Italy . 808 parts In-Stock

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$6.096

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Ampacity Inc.

Singapore . 1,240 parts In-Stock

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$7.000

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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Corohmni

South Africa . 203 parts In-Stock

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Continental Prestige Electronics

USA . 6,327 parts In-Stock

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XL Components Corporation

Australia . 6,297 parts In-Stock

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Marpe Global Electronics

Taiwan . 5,326 parts In-Stock

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Argo Parts USA

USA . 3,782 parts In-Stock

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Microchip USA

USA . 2,382 parts In-Stock

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Aranea Global

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QualityLine Systems

Poland . 1,118 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the DSPIC33FJ128GP706AT-I/MR from Microchip Technology. As a leader in digital signal processors, Microchip Technology ensures top-notch quality and reliability in every product. Ideal for a wide range of applications, this DSP offers customers exceptional value, benefits, and advantages. From its high clock frequency to flash ROM programmability, this chip delivers cutting-edge technology that will elevate your projects to new heights. Trust Microchip Technology for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the DSP, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power source options.

Package Shape: SQUARE

Compact square shape helps in optimizing space on the circuit board, allowing for more efficient design layouts.

Bit Size: 16

Offers high processing capability for digital signals with precision and accuracy.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 64

Sufficient number of terminals for connectivity and signal processing, enabling versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility for different implementation scenarios, catering to various design requirements.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, conserving power and facilitating energy-efficient designs.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains operational functionality even in extreme cold conditions, ensuring performance in diverse environments.

Terminal Finish: MATTE TIN

Provides a durable and corrosive-resistant finish on the terminals, enhancing the longevity of the DSP.

Terminal Position: QUAD

Quad terminal positioning offers stable and secure connections, minimizing signal interference and enhancing performance.

Maximum Seated Height: 1 mm

Low seated height contributes to a compact design, ideal for space-constrained applications.

Width: 9 mm

Narrow width dimension enables efficient integration into circuit boards, optimizing layout space.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for rapid processing of signals, ensuring real-time responsiveness in applications.

Maximum Time At Peak Reflow Temperature (s): 40

Capable of withstanding peak reflow temperatures for a specified duration, ensuring robustness during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enhances reliability and endurance of the DSP during soldering procedures.

Length: 9 mm

Compact length dimension contributes to a space-saving design layout on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures operational efficiency and reliability in demanding environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile peripheral IC type enables the DSP to perform diverse functions, enhancing its application versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing energy efficiency and signal integrity.

Terminal Form: NO LEAD

No lead terminal form minimizes connection resistance and signal loss, improving overall performance.

Maximum Supply Current: 90 mA

A moderate supply current requirement ensures efficient power usage and reduces strain on the power source.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage promotes consistent and reliable operation of the DSP.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in firmware updates and customization, adapting to evolving requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density terminal placement, maximizing connectivity options in a compact footprint.

Format: FIXED POINT

Fixed-point format enhances computational efficiency and simplifies signal processing algorithms, enabling faster operation.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to maintain component integrity.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP706AT-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ128GP706AT-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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