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DSPIC33EV64GM102T-I/SO

Microchip Technology

DSPIC33EV64GM102T-I/SO by Microchip Technology

DSPIC33EV64GM102T-I/SO by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 11-Ch 12-Bit ADCs, and 4 DMA channels. Ideal for industrial applications requiring high-speed processing, it features CAN, I2C, SPI connectivity options and low power mode for energy efficiency.

Median Price

$4.781

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$4.781

100+ parts

-

1k+ parts

-

10k+ parts

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46

$4.781

-

-

-

Vyrian

USA . 6,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,065

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.685

100+ parts

-

1k+ parts

$4.498

10k+ parts

-

500

$4.685

-

$4.498

-

Continental Prestige Electronics

USA . 4,639 parts In-Stock

1+ parts

$4.781

100+ parts

-

1k+ parts

-

10k+ parts

$4.685

4,639

$4.781

-

-

$4.685

AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

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10k+ parts

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246

$6.624

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Ampacity Inc.

Singapore . 1,251 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

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10k+ parts

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1,251

$14.000

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Aztec Data Supply Inc.

USA . 3,034 parts In-Stock

1+ parts

$38.765

100+ parts

-

1k+ parts

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10k+ parts

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3,034

$38.765

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Corohmni

South Africa . 2,587 parts In-Stock

1+ parts

$68.891

100+ parts

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1k+ parts

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10k+ parts

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2,587

$68.891

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Argo Parts USA

USA . 5,132 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,132

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Fulton Briggs Corp.

USA . 3,848 parts In-Stock

1+ parts

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100+ parts

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3,848

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology DSPIC33EV64GM102T-I/SO Digital Signal Processor. With a focus on quality and innovation, Microchip Technology delivers top-of-the-line products that exceed expectations. Ideal for a wide range of applications, this DSP offers unmatched value, performance, and reliability. Experience seamless connectivity, high-speed processing, and low power consumption in a compact package. Revolutionize your projects with the DSPIC33EV64GM102T-I/SO and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

With surface mount capability, this DSP can be easily integrated onto a PCB for efficient and compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and ensures reliable operation under various conditions.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 enhances data processing speed and efficiency, crucial for real-time applications.

Screening Level: TS 16949

The TS 16949 screening level signifies high quality and reliability standards, making this DSP a dependable choice for critical systems.

Package Shape: RECTANGULAR

The rectangular package shape provides easy handling and straightforward PCB layout, simplifying the integration process.

Bit Size: 16

The 16-bit architecture offers enhanced processing capabilities, suitable for complex signal processing tasks.

Power Supplies (V): 5

Operating at 5 V nominal supply voltage, this DSP strikes a balance between power efficiency and performance.

No. of Terminals: 28

The ample number of terminals allows for versatile connectivity options, facilitating interface with various external components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this DSP suitable for compact designs and applications with size constraints.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV64GM102T-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(4), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

DSPIC33EV64GM102T-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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