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DSPIC33EP64MC504-E/PTVAO

Microchip Technology

DSPIC33EP64MC504-E/PTVAO by Microchip Technology

DSPIC33EP64MC504-E/PTVAO by Microchip Technology is a 16-bit digital signal processor with 8192 RAM words and 60 MHz clock frequency. Ideal for automotive applications, it features AEC-Q100 screening, operates b/w -40 to 125 °C, and has low power mode enabled.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,635

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,586 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

-

10k+ parts

-

8,586

$4.010

-

-

-

Marpe Global Electronics

Taiwan . 3,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,970

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-

-

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QualityLine Systems

Poland . 3,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,970

-

-

-

-

XL Components Corporation

Australia . 3,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,970

-

-

-

-

Continental Prestige Electronics

USA . 3,135 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,135

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-

-

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Argo Parts USA

USA . 3,032 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,032

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-

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

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Overview

Elevate your projects with the Microchip Technology DSPIC33EP64MC504-E/PTVAO Digital Signal Processor. Known for their superior quality and cutting-edge technology, Microchip Technology delivers top-of-the-line products that exceed expectations. With a wide range of applications in various industries, this DSP provides unparalleled value, benefits, and advantages to customers. Experience seamless performance, reliability, and efficiency with this innovative solution. Choose Microchip Technology for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, enabling efficient PCB assembly processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources, enhancing flexibility in system design.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 enables efficient handling of data processing tasks, leading to improved performance.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 screening standards ensures high quality and reliability suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for compact and space-saving designs, making it ideal for applications with limited board space.

Bit Size: 16

A 16-bit architecture provides enhanced computational capabilities, enabling the product to handle complex signal processing tasks efficiently.

No. of Terminals: 44

Having 44 terminals allows for connectivity to a wide range of external components, expanding the product's versatility in system integration.

Package Style (Meter): FLATPACK, THIN PROFILE

A flatpack, thin profile package style offers a slim form factor, ideal for applications where space constraints are critical.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures reliable operation even in low-power scenarios, enhancing the product's overall robustness.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

No. of External Interrupts: 3

Having 3 external interrupts enables the product to respond to external events promptly, improving real-time processing capabilities.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40°C ensures reliable performance in cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and good solderability, ensuring reliable electrical connections and product longevity.

Terminal Position: QUAD

Quad terminal position allows for secure and stable mounting on PCBs, enhancing overall product durability and reliability.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, the product offers a low-profile design, making it suitable for applications where height restrictions are critical.

RAM Words: 8192

A large on-chip RAM capacity of 8192 words enables efficient data storage and processing, enhancing the product's performance in data-intensive applications.

Width: 10 mm

A compact width of 10mm allows for space-efficient PCB layout and integration, making the product suitable for applications with limited board space.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during manufacturing and maintenance, ensuring high product quality and reliability.

Maximum Clock Frequency: 60 MHz

Support for a maximum clock frequency of 60MHz enables fast data processing and real-time operation, making the product suitable for high-speed applications.

Length: 10 mm

A compact length of 10mm offers a space-saving design, ideal for applications where board space is limited and form factor is critical.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures that the product meets stringent quality and reliability standards required for automotive applications, ensuring long-term performance and durability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processing and controller functionalities in one device offers versatility and flexibility in a wide range of applications, simplifying system design.

No. of Timers: 5

Having 5 timers expands the product's capability for time-sensitive operations, allowing for precise timing control in a variety of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections and mechanical strength, ensuring robust performance in challenging operating conditions.

Maximum Supply Current: 55 mA

Support for a maximum supply current of 55mA ensures efficient power consumption, making the product suitable for low-power and portable applications.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V offers stable and reliable operation, ensuring consistent performance across varying operating conditions.

No. of DMA Channels: 4

Having 4 DMA channels enables efficient data transfer and processing, enhancing overall performance in data-intensive applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for firmware updates and customization, ensuring adaptability to changing system requirements.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the product allows for compact PCB layout and integration, enabling space-efficient designs in compact electronic devices.

Format: FIXED POINT

Fixed point format simplifies mathematical operations and enhances computational efficiency, making the product suitable for real-time signal processing applications.

Low Power Mode: YES

Low power mode capability enables energy-efficient operation, extending battery life and reducing power consumption in portable and battery-powered applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enhances program storage capacity, enabling the product to support a wide range of software applications and algorithms.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64MC504-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33EP64MC504-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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