Loading...

DSPIC33EP64GP502-E/SO

Microchip Technology

DSPIC33EP64GP502-E/SO by Microchip Technology

DSPIC33EP64GP502-E/SO by Microchip Technology is a 16-bit digital signal processor with 8192 RAM words and a max clock frequency of 60 MHz. Ideal for automotive applications, it features 3.3V nominal voltage, boundary scan support, and low power mode for efficient performance in various control systems.

Median Price

$3.440

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.440

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.440

-

-

-

Vyrian

USA . 7,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,242 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,242

$2.000

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.440

100+ parts

$3.371

1k+ parts

-

10k+ parts

-

50

$3.440

$3.371

-

-

AZTECH Wire

Italy . 498 parts In-Stock

1+ parts

$8.318

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$8.318

-

-

-

West Coast Incorporated

USA . 7,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,665

-

-

-

-

Overview

Unlock the full potential of your digital signal processing applications with the DSPIC33EP64GP502-E/SO by Microchip Technology. With a proven track record of manufacturing high-quality digital signal processors, Microchip Technology delivers reliable and efficient solutions for a wide range of industries. This powerful DSP offers unmatched performance and versatility, making it ideal for automotive, industrial, and consumer electronics applications. Experience seamless integration, enhanced functionality, and increased productivity with the DSPIC33EP64GP502-E/SO. Elevate your projects to the next level with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability of the package, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options.

On Chip Data RAM Width: 8

Wider data RAM width allows for faster data processing and more efficient operations.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability in automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit designs.

Bit Size: 16

16-bit processing capability enables handling of complex digital signals with high precision.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent performance of the DSP.

No. of Terminals: 28

Having 28 terminals allows for various connection options and interfaces.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low power scenarios.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range enables use in extreme environments.

No. of External Interrupts: 3

Having 3 external interrupts allows for efficient handling of external events and signals.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures performance in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB mounting options.

Maximum Seated Height: 2.65 mm

Low seated height allows for compact and slim designs.

RAM Words: 8192

Large RAM capacity enables storage of more data for processing.

Width: 7.5 mm

Narrow width allows for space-saving integration on the PCB.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during development and production.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast signal processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 40

40-second maximum time at peak reflow temperature ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures reliable solder joints and durability.

Length: 17.9 mm

Compact length allows for space-efficient placement on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature performance ensures reliability in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities offers versatile signal processing capabilities.

No. of Timers: 5

Having 5 timers allows for precise timing and control in various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure PCB mounting.

Maximum Supply Current: 55 mA

Low maximum supply current ensures energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance.

No. of DMA Channels: 4

Having 4 DMA channels allows for efficient data transfer and processing.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in firmware updates and customization.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connectivity and PCB layout.

Format: FIXED POINT

Fixed-point format provides efficient processing of integer-based computations.

Low Power Mode: YES

Low power mode option enables power-saving operation for extended battery life.

On Chip Program ROM Width: 8

Wider on-chip program ROM width allows for storage of more program instructions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64GP502-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP64GP502-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20