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DSPIC33EP512MC202-I/SO

Microchip Technology

DSPIC33EP512MC202-I/SO by Microchip Technology

DSPIC33EP512MC202-I/SO by Microchip Technology is a 16-bit digital signal processor with 49152 RAM words and 60 MHz max clock frequency. Ideal for industrial applications, it features 3.3 V nominal voltage, FLASH ROM programmability, and low power mode for efficient operation.

Median Price

$5.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 90 parts In-Stock

1+ parts

$5.100

100+ parts

$4.230

1k+ parts

$3.880

10k+ parts

$3.710

90

$5.100

$4.230

$3.880

$3.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 54 parts In-Stock

1+ parts

$5.280

100+ parts

$4.790

1k+ parts

$4.380

10k+ parts

-

54

$5.280

$4.790

$4.380

-

Vyrian

USA . 3,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,383

-

-

-

-

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

870

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 173 parts In-Stock

1+ parts

$4.130

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$4.130

-

-

-

Component Stockers USA

USA . 1,462 parts In-Stock

1+ parts

$5.030

100+ parts

$4.170

1k+ parts

-

10k+ parts

-

1,462

$5.030

$4.170

-

-

Marpe Global Electronics

Taiwan . 1,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,597

-

-

-

-

QualityLine Systems

Poland . 1,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,597

-

-

-

-

XL Components Corporation

Australia . 1,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,597

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Unlock the full potential of your designs with the DSPIC33EP512MC202-I/SO by Microchip Technology, a leading manufacturer in the field of Digital Signal Processors. This powerful DSP offers unparalleled performance and reliability, making it ideal for a wide range of applications. With cutting-edge technology and innovative features, this product provides exceptional value to customers seeking high-quality solutions for their projects. Experience the benefits of top-notch engineering and precise functionality with the DSPIC33EP512MC202-I/SO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components.

Surface Mount: YES

Being surface mountable makes this DSP easy to incorporate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in the power source and can accommodate a wide range of applications.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 allows for efficient data processing and storage capabilities.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape is versatile and easy to handle during assembly and mounting processes.

Bit Size: 16

With a 16-bit size, this DSP can handle complex calculations and data processing tasks effectively.

Power Supplies (V): 3.3

Operating at a power supply voltage of 3.3V allows for compatibility with common power sources and efficient power consumption.

No. of Terminals: 28

Having a sufficient number of terminals provides ample connectivity options for interfacing with external components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and efficient power management.

Maximum Operating Temperature: 85 °C

Being able to operate at a high temperature of 85°C makes this DSP suitable for industrial environments with demanding temperature conditions.

No. of External Interrupts: 3

With 3 external interrupts, this DSP can efficiently handle external events and interrupts for responsive operation.

Minimum Operating Temperature: -40 °C

The ability to operate at a low temperature of -40°C enables this DSP to be used in cold environments without performance degradation.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

With dual terminal positions, this DSP offers flexibility in circuit board layout and connection options.

Maximum Seated Height: 2.65 mm

The low maximum seated height makes this DSP suitable for slim and compact electronic designs.

RAM Words: 49152

With a large number of RAM words, this DSP can efficiently store and process data for complex applications.

Width: 7.5 mm

The narrow width of 7.5mm allows for compact integration and space-saving in electronic designs.

Boundary Scan: YES

Having boundary scan capability enables easy testing and debugging of the DSP during the manufacturing process.

Maximum Clock Frequency: 60 MHz

Operating at a high clock frequency of 60 MHz allows for fast and efficient signal processing.

Length: 17.9 mm

The moderate length of 17.9mm provides a good balance between compactness and usability in electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typical of industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The integration of digital signal processing and control capabilities in one IC simplifies system design and reduces component count.

No. of Timers: 5

Having 5 timers allows for precise timing control and scheduling of tasks in the DSP.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mounting and provides secure mechanical connection.

Maximum Supply Current: 55 mA

Operating at a maximum supply current of 55 mA ensures efficient power consumption and reduces heat generation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources and stable operation.

No. of DMA Channels: 4

Having 4 DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention.

ROM Programmability: FLASH

The flash ROM programmability allows for easy firmware updates and customization of the DSP functionality.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm enables easy soldering and assembly of the DSP onto circuit boards.

Format: FIXED POINT

Operating in fixed-point format simplifies arithmetic calculations and reduces computational complexity.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation and prolongs battery life in portable devices.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 provides ample storage for program code and enhances program execution efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MC202-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

DSPIC33EP512MC202-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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