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DSPIC33EP512GP506-I/MR

Microchip Technology

DSPIC33EP512GP506-I/MR by Microchip Technology

DSPIC33EP512GP506-I/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It operates at supply voltages b/w 3V to 3.6V, making it suitable for industrial applications requiring high-speed processing and low power consumption. With features like flash ROM programmability and boundary scan support, it is ideal for embedded control systems in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,789 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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40

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Ampacity Inc.

Singapore . 300 parts In-Stock

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$5.460

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$5.460

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AZTECH Wire

Italy . 436 parts In-Stock

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$11.770

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$24.762

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$24.514

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$23.524

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$24.762

$24.514

$23.524

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Corohmni

South Africa . 400 parts In-Stock

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$27.816

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Marpe Global Electronics

Taiwan . 4,280 parts In-Stock

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QualityLine Systems

Poland . 4,280 parts In-Stock

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XL Components Corporation

Australia . 4,280 parts In-Stock

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Argo Parts USA

USA . 2,968 parts In-Stock

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Continental Prestige Electronics

USA . 682 parts In-Stock

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Netroflash

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33EP512GP506-I/MR. Manufactured by a trusted industry leader, this chip offers unparalleled performance and reliability. Ideal for a wide range of applications, it provides customers with exceptional value, precision, and efficiency. Say goodbye to compromise and experience cutting-edge technology at your fingertips with the DSPIC33EP512GP506-I/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for a higher power supply voltage, which can improve the performance and processing capabilities of the DSP.

RAM Words: 49152

With a large amount of RAM words, the DSP can handle and process a significant amount of data efficiently.

Maximum Clock Frequency: 60 MHz

A high clock frequency enables fast processing speeds, making the DSP suitable for demanding and real-time applications.

ROM Programmability: FLASH

The ability to program the ROM memory using flash technology provides flexibility and ease of updating the firmware of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the DSP energy efficient and effective for a wide range of applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GP506-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP512GP506-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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