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DSPIC33EP512GP502T-E/SO

Microchip Technology

DSPIC33EP512GP502T-E/SO by Microchip Technology

DSPIC33EP512GP502T-E/SO by Microchip is a 16-bit DSP with max clock freq of 60MHz, suitable for automotive applications. It operates at -40 to 125°C, with supply voltage range of 3-3.6V and peak current of 150mA. Ideal for digital signal processing tasks in compact designs due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,300 parts In-Stock

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Nova Conductors

Japan . 59 parts In-Stock

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59

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Distributors (Availability)

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AZTECH Wire

Italy . 656 parts In-Stock

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$5.611

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656

$5.611

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Ampacity Inc.

Singapore . 568 parts In-Stock

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$12.000

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568

$12.000

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West Coast Incorporated

USA . 6,713 parts In-Stock

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Microchip USA

USA . 166 parts In-Stock

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166

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the DSPIC33EP512GP502T-E/SO by Microchip Technology. Designed to deliver unparalleled performance in Digital Signal Processors (DSPs), this product boasts a superior quality that sets it apart from the competition. With a maximum clock frequency of 60 MHz and a wide temperature range, this device is ideal for automotive applications where reliability is key. Trust in Microchip Technology's expertise to provide you with a solution that exceeds your expectations. Elevate your projects with the DSPIC33EP512GP502T-E/SO and experience the ultimate in efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product even in harsh environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in power requirements for various applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this DSP suitable for automotive applications.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and signals, making the product suitable for real-time applications.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, making it compatible with popular power sources.

No. of Terminals: 28

The ample number of terminals allow for easy connectivity and integration with other components in a system.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 125°C ensures stable performance in varied environments.

Maximum Clock Frequency: 60 MHz

With a maximum clock frequency of 60MHz, this DSP can handle high-speed processing tasks efficiently.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this DSP meets the stringent requirements for temperature and reliability in vehicles.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GP502T-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP512GP502T-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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