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DSPIC33EP128GS702-I/2N

Microchip Technology

DSPIC33EP128GS702-I/2N by Microchip Technology

DSPIC33EP128GS702-I/2N by Microchip Technology is a 16-bit DSP with 131072 ROM words and 8192 RAM words. It features 11-Ch 12-Bit ADCs, 1-Ch 12-Bit DAC, and peripherals like PWM(16) for industrial applications. With a max clock frequency of 60 MHz, it offers low power mode and boundary scan capability.

Median Price

$6.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 8 parts In-Stock

1+ parts

$1.520

100+ parts

$1.520

1k+ parts

-

10k+ parts

-

8

$1.520

$1.520

-

-

Microchip Technology

USA . 2,855 parts In-Stock

1+ parts

$6.460

100+ parts

$5.380

1k+ parts

$4.930

10k+ parts

$4.690

2,855

$6.460

$5.380

$4.930

$4.690

Mouser Electronics

USA . 102 parts In-Stock

1+ parts

$6.460

100+ parts

$5.380

1k+ parts

-

10k+ parts

-

102

$6.460

$5.380

-

-

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$5.700

1k+ parts

$5.100

10k+ parts

$4.800

25

-

$5.700

$5.100

$4.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$5.765

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$5.765

-

-

-

NAC Semi

USA . 2,318 parts In-Stock

1+ parts

$6.710

100+ parts

$6.080

1k+ parts

$5.560

10k+ parts

-

2,318

$6.710

$6.080

$5.560

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Vyrian

USA . 6,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,883

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,174 parts In-Stock

1+ parts

$5.469

100+ parts

-

1k+ parts

-

10k+ parts

-

3,174

$5.469

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.650

1k+ parts

$5.477

10k+ parts

$5.362

2,000

-

$5.650

$5.477

$5.362

Argo Parts USA

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

-

-

-

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West Coast Incorporated

USA . 999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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999

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the DSPIC33EP128GS702-I/2N by Microchip Technology, a leading manufacturer in the industry. This Digital Signal Processor offers unrivaled performance and versatility for a wide range of applications, from industrial automation to consumer electronics. Experience seamless connectivity, superior data processing, and efficient power management all in one compact package. Elevate your projects with the value, benefits, and advantages that only Microchip Technology can deliver. Choose innovation, choose quality, choose the DSPIC33EP128GS702-I/2N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ideal for cost-effective designs and durability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, increasing compatibility.

ADC Channels: YES

Ability to convert analog signals to digital values for processing.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast data processing.

Connectivity: CAN(2), I2C(2), SPI(3), UART(2)

Multiple communication interfaces provide flexibility in connecting to other devices.

RAM Bytes: 8192

Sufficient RAM for storing data and instructions during processing.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device.

Low Power Mode: YES

Ability to operate in low power mode conserves energy and extends battery life.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS702-I/2N attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

20

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS702-I/2N Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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