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DSPIC33CH64MP502-I/SS

Microchip Technology

DSPIC33CH64MP502-I/SS by Microchip Technology

DSPIC33CH64MP502-I/SS by Microchip Technology is a 16-bit digital signal processor with 8-bit on-chip data RAM. It operates at a max clock frequency of 64 MHz and has 16384 RAM words. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 314 parts In-Stock

1+ parts

$2.320

100+ parts

$1.910

1k+ parts

$1.750

10k+ parts

$1.670

314

$2.320

$1.910

$1.750

$1.670

DigiKey

USA . 283 parts In-Stock

1+ parts

$2.320

100+ parts

$1.910

1k+ parts

-

10k+ parts

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283

$2.320

$1.910

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Mouser Electronics

USA . 98 parts In-Stock

1+ parts

$2.320

100+ parts

$1.910

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-

10k+ parts

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98

$2.320

$1.910

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,016 parts In-Stock

1+ parts

-

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4,016

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 475 parts In-Stock

1+ parts

$1.970

100+ parts

-

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475

$1.970

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Corohmni

South Africa . 600 parts In-Stock

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$44.290

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600

$44.290

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RGB Technical Solutions

Ukraine . 5,635 parts In-Stock

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5,635

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Lixinc

USA . 2,895 parts In-Stock

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2,895

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Argo Parts USA

USA . 2,172 parts In-Stock

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2,172

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 468 parts In-Stock

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468

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Overview

Unlock unparalleled performance and efficiency with the DSPIC33CH64MP502-I/SS by Microchip Technology. As a leader in digital signal processors, Microchip delivers cutting-edge technology that meets the demands of today's fast-paced world. Whether you're in the automotive, industrial, or consumer electronics industry, this product offers unmatched value, benefits, and advantages to help you stay ahead of the competition. Experience the power of innovation with Microchip Technology. Choose excellence, choose DSPIC33CH64MP502-I/SS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection.

Surface Mount: YES

Easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs for versatile usage.

On Chip Data RAM Width: 8

Efficient data processing capability with a wider RAM width.

Bit Size: 16

Higher bit size allows for more precise calculations and operations.

No. of Terminals: 28

Sufficient number of terminals for connections and interfaces.

Maximum Clock Frequency: 64 MHz

High clock frequency for fast signal processing and response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of software.

Maximum Seated Height: 2 mm

Low profile design for space-saving and compact applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CH64MP502-I/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

4K BYTES INTERNAL DATA RAM IN SLAVE CORE AVAILABLE

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Maximum Supply Current:

63.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

DSPIC33CH64MP502-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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