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DSPIC33CH512MP506T-I/MR

Microchip Technology

DSPIC33CH512MP506T-I/MR by Microchip Technology

DSPIC33CH512MP506T-I/MR by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 49152 RAM words, and 98 mA max supply current. Ideal for industrial applications requiring high-speed processing, it features FLASH ROM programmability, low power mode, and 8 DMA channels for efficient data transfer.

Median Price

$7.660

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$7.660

100+ parts

-

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900

$7.660

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Vyrian

USA . 7,538 parts In-Stock

1+ parts

-

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7,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,198 parts In-Stock

1+ parts

$7.660

100+ parts

-

1k+ parts

-

10k+ parts

$7.507

6,198

$7.660

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-

$7.507

AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$15.389

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839

$15.389

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Ampacity Inc.

Singapore . 313 parts In-Stock

1+ parts

$18.000

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313

$18.000

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Aztec Data Supply Inc.

USA . 3,479 parts In-Stock

1+ parts

$31.780

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3,479

$31.780

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Corohmni

South Africa . 37 parts In-Stock

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$61.290

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37

$61.290

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XL Components Corporation

Australia . 8,196 parts In-Stock

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8,196

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QualityLine Systems

Poland . 6,707 parts In-Stock

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6,707

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Marpe Global Electronics

Taiwan . 4,827 parts In-Stock

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4,827

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Argo Parts USA

USA . 1,089 parts In-Stock

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1,089

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$7.507

1k+ parts

$7.277

10k+ parts

$7.124

50

-

$7.507

$7.277

$7.124

Overview

Enhance your digital signal processing capabilities with the Microchip Technology DSPIC33CH512MP506T-I/MR. Manufactured by a trusted industry leader, this high-quality DSP offers unparalleled performance and versatility for a wide range of applications. With its cutting-edge technology and innovative features, this product provides exceptional value and benefits to customers looking to optimize their projects. Trust in Microchip Technology to deliver top-notch solutions that exceed expectations and drive success in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of components.

Surface Mount: YES

Allows for easy installation and compact design in various applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for flexibility in power sources.

On Chip Data RAM Width: 8

Efficient data processing with a wide RAM width for quick access.

Package Shape: SQUARE

Compact shape for space-saving integration in electronic circuits.

Bit Size: 16

High precision and accuracy in digital signal processing tasks.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles for different installation methods and heat dissipation needs.

Minimum Supply Voltage: 3 V

Allows for operation in low power scenarios while ensuring stability.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance in various environments.

No. of External Interrupts: 3

Supports external event triggers for efficient multitasking capabilities.

Minimum Operating Temperature: -40 °C

Can function in extreme cold temperatures without compromising performance.

Terminal Position: QUAD

Organized terminal layout for easy connectivity and circuit design.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

RAM Words: 49152

Large memory capacity for storing and processing data efficiently.

Width: 9 mm

Compact width for easy integration into circuit boards or modules.

Boundary Scan: YES

Facilitates testing and debugging during manufacturing or maintenance processes.

Maximum Clock Frequency: 64 MHz

High clock speed for fast signal processing and response times.

Internal Bus Architecture: MULTIPLE

Efficient data transfer between components for seamless operations.

Length: 9 mm

Uniform dimensions for a symmetrical layout in electronic systems.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding temperature requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for diverse processing tasks.

No. of Timers: 6

Multiple timers for scheduling tasks and managing time-sensitive operations.

Technology: CMOS

Energy-efficient technology for reduced power consumption and heat generation.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly manufacturing and disposal.

Maximum Supply Current: 98 mA

Moderate power usage for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with common power sources.

No. of DMA Channels: 8

Multiple channels for efficient data transfer and processing.

No. of Serial I/Os: 2

Serial I/O interfaces for communication with external devices or modules.

ROM Programmability: FLASH

Easily programmable ROM for seamless updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections in compact spaces.

Format: FIXED POINT

Fixed point format for accurate numerical calculations in DSP operations.

Low Power Mode: YES

Enables energy-saving modes for extended battery life and reduced power consumption.

Barrel Shifter: YES

Efficient data manipulation capabilities for complex signal processing tasks.

On Chip Program ROM Width: 24

Wide ROM width for storing program instructions and data efficiently.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CH512MP506T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

16kbytes slave core Ram available

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

98 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CH512MP506T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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