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DSPIC30F6011AT-30I/PT

Microchip Technology

DSPIC30F6011AT-30I/PT by Microchip Technology

DSPIC30F6011AT-30I/PT by Microchip is a 16-bit DSP with max clock freq of 40MHz. It operates at -40 to 85°C, has 64 terminals, and uses CMOS technology. Ideal for industrial applications requiring a digital signal processor/controller with flash ROM programmability.

Median Price

$12.970

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 47 parts In-Stock

1+ parts

$12.970

100+ parts

$12.592

1k+ parts

-

10k+ parts

$10.700

47

$12.970

$12.592

-

$10.700

Distributors (In-Stock)

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IBS Electronics

USA . 12,000 parts In-Stock

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-

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$15.989

12,000

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$15.989

Vyrian

USA . 9,904 parts In-Stock

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9,904

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 97 parts In-Stock

1+ parts

$11.020

100+ parts

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97

$11.020

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iodParts Technologies Inc.

India . 9,000 parts In-Stock

1+ parts

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9,000

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Continental Prestige Electronics

USA . 4,219 parts In-Stock

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4,219

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Argo Parts USA

USA . 2,769 parts In-Stock

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2,769

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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West Coast Incorporated

USA . 1,114 parts In-Stock

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1,114

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Corohmni

South Africa . 101 parts In-Stock

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101

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Overview

Discover the power and precision of the DSPIC30F6011AT-30I/PT by Microchip Technology, a leader in digital signal processors. This dynamic device offers unparalleled performance for a wide range of applications, delivering superior quality and reliability. With advanced features and cutting-edge technology, this product provides exceptional value and benefits to customers looking for top-of-the-line solutions. Whether you're working on industrial automation, motor control, or audio processing, this DSP will exceed your expectations every time. Elevate your projects with the DSPIC30F6011AT-30I/PT and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this DSP can handle a wide range of power inputs, making it versatile for different applications.

Bit Size: 16

The 16-bit size allows for high precision and accuracy in signal processing, making this DSP suitable for tasks that require complex calculations.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures that this DSP can function reliably even in harsh environments with extreme cold temperatures.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz enables fast processing of signals, making this DSP ideal for real-time applications that require quick data analysis.

ROM Programmability: FLASH

The ROM programmability using flash technology allows for easy and quick updates to the DSP's program, ensuring flexibility and adaptability to changing requirements.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6011AT-30I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC30F6011AT-30I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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