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APTGL60TL120T3G

Microchip Technology

APTGL60TL120T3G by Microchip Technology

Microchip Technology's APTGL60TL120T3G is an N-CHANNEL IGBT with a max VCEsat of 2.2V and a max collector current (IC) of 80A. It is commonly used for power control applications due to its high power dissipation of 280W and max operating temperature of 175°C.

Median Price

$111.905

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 91 parts In-Stock

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VNN

France . 23,203 parts In-Stock

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Vyrian

USA . 1,625 parts In-Stock

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AZTECH Wire

Italy . 807 parts In-Stock

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$5.667

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Ampacity Inc.

Singapore . 1,597 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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$109.666

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$105.280

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Continental Prestige Electronics

USA . 684 parts In-Stock

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Microchip USA

USA . 7,729 parts In-Stock

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$158.355

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QUARKTWIN TECHNOLOGY LTD

USA . 27,016 parts In-Stock

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West Coast Incorporated

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Experience the power and precision of the APTGL60TL120T3G by Microchip Technology. As a leading manufacturer in the industry, Microchip brings you a high-quality Insulated Gate Bipolar Transistor (IGBT) that sets new standards for performance. With its N-CHANNEL polarity and complex configuration, this IGBT is perfect for power control applications. What sets it apart is its maximum VCEsat of just 2.2V, allowing for efficient power dissipation and operation at temperatures up to 175°C. With 4 elements and 16 terminals, this rectangular-shaped IGBT offers exceptional reliability and flexibility. Discover the value and benefits of the APTGL60TL120T3G and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - This N-CHANNEL polarity allows for efficient power control, making it a good choice for various applications.

Configuration

COMPLEX - The COMPLEX configuration of this IGBT product enables enhanced performance and versatility, making it suitable for power control in a wide range of applications.

Transistor Application

POWER CONTROL - Specifically designed for power control applications, this IGBT product ensures efficient and reliable performance in controlling power circuits.

Maximum VCEsat

2.2 V - With a low maximum VCEsat of 2.2 V, this IGBT allows for minimal voltage drop and contributes to improved overall system efficiency.

Package Shape

RECTANGULAR - The RECTANGULAR package shape provides easy integration and mounting options, making it convenient for various industrial and commercial applications.

No. of Elements

4 - Featuring four elements, this IGBT product can efficiently handle high power levels and complex power control requirements.

Nominal Turn Off Time (toff)

370 ns - With a relatively fast turn off time of 370 ns, this IGBT offers quick response and enables better control over power circuits, making it suitable for dynamic power control applications.

No. of Terminals

16 - Having 16 terminals, this IGBT provides ample connectivity options, enhancing its compatibility and flexibility in power control systems.

Maximum Power Dissipation (Abs)

280 W - With a high maximum power dissipation of 280 W, this IGBT can handle significant power loads without compromising its performance, making it reliable for demanding power control applications.

Package Style (Meter)

FLANGE MOUNT - The FLANGE MOUNT package style ensures secure and stable installation, adding to the durability and long-term reliability of this IGBT product.

Maximum Operating Temperature

175 °C - Designed to withstand high operating temperatures of up to 175°C, this IGBT maintains performance and stability even in challenging environments.

Maximum Collector-Emitter Voltage

1200 V - Offering a maximum collector-emitter voltage of 1200 V, this IGBT product is suitable for power control applications in systems requiring high voltage handling capabilities.

Transistor Element Material

SILICON - Utilizing silicon as the transistor element material ensures excellent performance and reliability, making this IGBT a dependable choice for power control requirements.

Maximum Gate-Emitter Voltage

20 V - With a maximum gate-emitter voltage of 20 V, this IGBT allows for precise control and efficient power switching, contributing to improved overall system performance.

Maximum Collector Current (IC)

80 A - Capable of handling a maximum collector current of 80 A, this IGBT product provides robust power control capabilities, making it suitable for high-current applications.

Terminal Position

UPPER - Featuring an upper terminal position, this IGBT facilitates easy and organized circuitry connections, simplifying installation and maintenance processes.

Case Connection

ISOLATED - The ISOLATED case connection of this IGBT ensures proper electrical insulation, enhancing safety and minimizing the risk of circuit malfunctions.

Nominal Turn On Time (ton)

80 ns - With a nominal turn on time of 80 ns, this IGBT enables fast and precise power switching, allowing for efficient control in various power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APTGL60TL120T3G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X16

No. of Elements:

4

No. of Terminals:

16

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

370 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

2.2 V

Trade Compliance

APTGL60TL120T3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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