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AGL600V5-FGG256

Microchip Technology

AGL600V5-FGG256 by Microchip Technology

Microchip's AGL600V5-FGG256 is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates at 1.425-1.575 V, has 177 inputs/outputs, and can withstand temperatures from 0-85°C. Ideal for applications requiring high gate count and low power consumption in a compact grid array package.

Median Price

$93.905

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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VNN

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Chip Stock

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Vyrian

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Digiode

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Distributors (Availability)

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AZTECH Wire

Italy . 250 parts In-Stock

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$8.235

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Semicontronic

India . 174 parts In-Stock

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$8.775

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$8.730

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Continental Prestige Electronics

USA . 4,707 parts In-Stock

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$92.027

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Netroflash

USA . 100 parts In-Stock

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$89.210

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$87.332

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,473 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Ledger Components

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Montano Global Distributors

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Alle Elektronik GmbH

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NIA Electronics

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LMD Electronica

Estonia . 2,256 parts In-Stock

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Argo Parts USA

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Corphita

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LOOK Integrated Logistics

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Kepictronics

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Overview

Unlock the power of cutting-edge technology with the AGL600V5-FGG256 from Microchip Technology. As a leader in the field programmable gate arrays (FPGA) category, Microchip delivers unmatched quality and reliability. With 13824 logic cells and 600000 equivalent gates, this FPGA offers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, the AGL600V5-FGG256 provides the value, benefits, and advantages that customers need to stay ahead in today's competitive market. Experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 13824

With a high number of logic cells, this FPGA is suitable for complex digital designs.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage range provides flexibility in power supply options.

Technology Used: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 177

The ample number of inputs makes this FPGA suitable for applications requiring multiple input signals.

Package Shape: SQUARE

The square package shape allows for efficient use of board space.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process during installation.

No. of Equivalent Gates: 600000

The high number of equivalent gates indicates the FPGA's processing capability.

Nominal Supply Voltage (V): 1.5

The standardized nominal supply voltage ensures compatibility with common power sources.

No. of Terminals: 256

The plentiful terminals provide versatile connectivity options for various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers flexibility for reprogramming and customization as needed.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient routing of signals on the FPGA.

Minimum Supply Voltage: 1.425 V

The low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in various environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of the terminals enables high-density PCB design.

Organization: 600000 GATES

The well-organized structure of 600,000 gates facilitates efficient logic design implementation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for operation in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures reliable connections and corrosion resistance.

Position Of Terminal: BOTTOM

Having terminals at the bottom simplifies the installation process and improves signal integrity.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates the level of protection against moisture, making this FPGA suitable for a variety of environments.

Maximum Seated Height: 1.8 mm

The low seated height allows for compact and slim design integration.

Width: 17 mm

The moderate width dimension enables flexibility in board layout and design.

No. of Outputs: 177

The ample number of outputs supports applications requiring multiple output signals.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures efficient soldering during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures the reliability of solder joints during assembly.

Length: 17 mm

The moderate length dimension facilitates easy integration into various PCB layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGL600V5-FGG256 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

13824

No. of Inputs:

177

No. of Outputs:

177

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AGL600V5-FGG256 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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