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AGL600V2-FGG256I

Microchip Technology

AGL600V2-FGG256I by Microchip Technology

Microchip Technology's AGL600V2-FGG256I is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates at a voltage range of 1.14V to 1.575V, suitable for industrial applications requiring high gate count and low power consumption. The package style is grid array with square shape, making it ideal for surface mount designs in various electronic systems.

Median Price

$127.050

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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DigiKey

USA . 39 parts In-Stock

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Microchip Technology

USA . 7 parts In-Stock

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$123.140

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$66.710

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Verical

USA . 22 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$111.540

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Digiode

USA . 139 parts In-Stock

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Vyrian

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VNN

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Chip Stock

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Prism Electronics

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AZTECH Wire

Italy . 285 parts In-Stock

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$16.196

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Corohmni

South Africa . 87 parts In-Stock

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$85.407

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Semicontronic

India . 81 parts In-Stock

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$107.990

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$105.290

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$104.750

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Continental Prestige Electronics

USA . 1,834 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$105.963

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$103.732

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Advanced Electronics

New Zealand . 24 parts In-Stock

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Corphita

USA . 358 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,471 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,951 parts In-Stock

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Ledger Components

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NIA Electronics

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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LMD Electronica

Estonia . 1,797 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

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Montano Global Distributors

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the AGL600V2-FGG256I by Microchip Technology. This Field Programmable Gate Array (FPGA) boasts 13824 logic cells and 600000 equivalent gates, providing unparalleled performance for a wide range of applications. With a nominal supply voltage of 1.2V and a maximum operating temperature of 100°C, this FPGA is designed to deliver reliable results in even the most demanding environments. Trust in the quality and expertise of Microchip Technology to bring you a product that offers exceptional value, benefits, and advantages to meet your unique needs. Elevate your projects to new heights with the AGL600V2-FGG256I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, ensuring reliable performance.

No. of Logic Cells: 13824

With a large number of logic cells, this FPGA can handle complex designs and computations efficiently.

Maximum Supply Voltage: 1.575 V

Allows for flexibility in power supply options without exceeding the maximum voltage rating.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for FPGA applications.

No. of Inputs: 177

Sufficient input channels for connecting to various external devices and sensors.

No. of Equivalent Gates: 600000

High gate count enables implementation of complex digital circuits and algorithms.

Nominal Supply Voltage (V): 1.2

Stable supply voltage for consistent performance and reliability.

Pitch Of Terminal: 1 mm

Close terminal spacing allows for compact design and efficient routing of signals.

Maximum Operating Temperature: 100 °C

Capable of operating in high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Wide temperature range support for operation in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGL600V2-FGG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

13824

No. of Inputs:

177

No. of Outputs:

177

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AGL600V2-FGG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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