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AGL600V2-FGG144I

Microchip Technology

AGL600V2-FGG144I by Microchip Technology

Microchip Technology's AGL600V2-FGG144I is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates at a nominal voltage of 1.2V, suitable for industrial applications requiring high gate count and low profile grid array packaging. With 97 inputs and outputs, it offers flexibility for complex digital designs in harsh environments.

Median Price

$116.870

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 284 parts In-Stock

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$116.870

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Microchip Technology

USA . 75 parts In-Stock

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$116.870

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$113.270

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$61.350

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Mouser Electronics

USA . 2 parts In-Stock

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$116.870

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Nova Conductors

Japan . 33 parts In-Stock

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Digiode

USA . 432 parts In-Stock

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$111.026

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Vyrian

USA . 3,411 parts In-Stock

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VNN

France . 1,946 parts In-Stock

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Chip Stock

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IBS Electronics

USA . 640 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 723 parts In-Stock

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$9.563

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Semicontronic

India . 71 parts In-Stock

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$99.340

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$96.856

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$96.360

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Continental Prestige Electronics

USA . 5,582 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 196 parts In-Stock

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Corohmni

South Africa . 857 parts In-Stock

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Aztec Data Supply Inc.

USA . 263 parts In-Stock

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RGB Technical Solutions

Ukraine . 8,340 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Looking for a reliable Field Programmable Gate Array (FPGA) solution? Look no further than the AGL600V2-FGG144I by Microchip Technology. With its 13824 logic cells and 600000 equivalent gates, this FPGA offers unmatched performance and versatility. Whether you're designing industrial automation systems or high-speed communication networks, the AGL600V2-FGG144I delivers the power and efficiency you need. Trust in Microchip Technology's reputation for quality and innovation to take your projects to the next level. Unlock endless possibilities with the AGL600V2-FGG144I FPGA today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good mechanical strength and thermal stability, making the product durable and reliable.

No. of Logic Cells: 13824

Having a high number of logic cells allows for complex programming and customization, making the product versatile for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and enhancing the overall design.

Maximum Supply Voltage: 1.575 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat dissipation, leading to energy efficiency.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the overall performance and reliability of the product.

No. of Inputs: 97

With a high number of inputs, the product can handle a wide range of input signals, ensuring flexibility in its usage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards and facilitates easier routing of traces for optimal signal integrity.

No. of Equivalent Gates: 600000

Having a large number of equivalent gates enables complex logic functions to be implemented, making the product suitable for advanced applications.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance and reliability of the product under normal operating conditions.

No. of Terminals: 144

Having a high number of terminals provides ample connectivity options and facilitates interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for on-the-fly reprogramming and customization, making the product adaptable to changing requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style with low profile design enhances thermal performance and allows for efficient heat dissipation, improving overall reliability.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures proper functionality even at low power levels, extending the product's operating range.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures the product can withstand harsh environmental conditions without compromising performance.

Pitch Of Terminal: 1 mm

With a small pitch of terminals, the product offers high density interconnects, enabling compact and space-efficient circuit designs.

Organization: 600000 GATES

Organized into 600000 gates, the product can handle complex logic operations efficiently, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the product to function reliably in extreme cold conditions, increasing its versatility.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of high-quality terminal finishing materials like tin, silver, and copper ensures good conductivity and corrosion resistance, enhancing the product's longevity.

Position Of Terminal: BOTTOM

Having terminals at the bottom of the package eases the soldering process and improves the overall mechanical stability of the product during assembly.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product is suitable for industrial environments with moderate exposure to moisture, ensuring long-term reliability.

Maximum Seated Height: 1.55 mm

Low maximum seated height allows for compact device designs and reduces the overall profile of the product, making it ideal for space-constrained applications.

Width: 13 mm

With a narrow width of 13mm, the product can be easily integrated into tight spaces without compromising on functionality or performance.

No. of Outputs: 97

Having a high number of outputs enables the product to drive multiple loads or interfaces, enhancing its capability to handle complex output signals.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing a maximum of 30 seconds at peak reflow temperature ensures proper soldering of the product during assembly, preventing thermal damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures reliable solder joints and overall robustness during the assembly process.

Length: 13 mm

Compact length of 13mm contributes to the overall small form factor of the product, making it suitable for applications where space is a constraint.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures the product can operate reliably in a wide temperature range, making it suitable for demanding industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGL600V2-FGG144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

13824

No. of Inputs:

97

No. of Outputs:

97

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA144,12X12,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AGL600V2-FGG144I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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