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AGL600V2-FGG256

Microchip Technology

AGL600V2-FGG256 by Microchip Technology

Microchip Technology's AGL600V2-FGG256 is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates at a nominal voltage of 1.2V, suitable for applications requiring high-density programmable ICs in a grid array package style. With 177 inputs and outputs, it offers flexibility for various digital design projects.

Median Price

$106.799

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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VNN

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Chip Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 468 parts In-Stock

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Semicontronic

India . 1,081 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,424 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$108.935

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Corohmni

South Africa . 136 parts In-Stock

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Aztec Data Supply Inc.

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S.R.D Solutions

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CPlus Electronics

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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RGB Technical Solutions

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Alle Elektronik GmbH

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Argo Parts USA

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Glotronic Ltd.

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Corphita

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Perfect Parts

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Overview

Unlock limitless possibilities with the AGL600V2-FGG256 by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) boasts 13824 logic cells and 600,000 equivalent gates, offering unparalleled performance and flexibility. With a maximum supply voltage of 1.575V and advanced CMOS technology, this FPGA is ideal for a wide range of applications. Whether you're designing high-performance computing systems or implementing complex algorithms, the AGL600V2-FGG256 delivers the power and reliability you need. Trust Microchip Technology's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 13824

With a large number of logic cells, this FPGA can handle complex logic functions efficiently.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for versatility in power supply options.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 177

A high number of inputs allows for connecting multiple external devices and sensors.

Package Shape: SQUARE

Square packages are easy to handle and provide uniform mounting options.

No. of Equivalent Gates: 600000

The high number of equivalent gates indicates the processing power and capability of this FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage ensures stable performance under normal operating conditions.

No. of Terminals: 256

Having a large number of terminals allows for more connectivity options and flexibility in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, it can be customized and reconfigured based on specific application requirements.

Package Style (Meter): GRID ARRAY

Grid array packages offer high-density mounting and excellent thermal performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power usage and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for precise and compact placement on the circuit board.

Organization: 600000 GATES

The organized structure of 600,000 gates facilitates efficient routing of signals and logic functions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing enhances the durability and conductivity of the terminals.

Position Of Terminal: BOTTOM

Bottom positioning of terminals allows for easy soldering and secure connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FPGA has a moderate level of sensitivity to moisture, which is acceptable for most applications.

Maximum Seated Height: 1.8 mm

The low maximum seated height saves space and allows for compact designs.

Width: 17 mm

The 17mm width provides a good balance between size and functionality in different applications.

No. of Outputs: 177

Having a high number of outputs allows for driving multiple devices and signals from the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this FPGA can be easily soldered onto the PCB during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures reliable solder joints and long-term durability of the device.

Length: 17 mm

The 17mm length provides a compact form factor while accommodating the required functionality of the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AGL600V2-FGG256 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

13824

No. of Inputs:

177

No. of Outputs:

177

No. of Equivalent Gates:

600000

Technology:

CMOS

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

AGL600V2-FGG256 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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