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93LC66CT-I/ST

Microchip Technology

93LC66CT-I/ST by Microchip Technology

93LC66CT-I/ST by Microchip Tech is a 256x16 EEPROM with 3V nominal voltage, operating at -40 to 85°C. It features serial interface, software write protection, and MICROWIRE bus type. Ideal for industrial applications requiring low power consumption and high endurance of 1M cycles.

Median Price

$0.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,665 parts In-Stock

1+ parts

$0.410

100+ parts

$0.370

1k+ parts

$0.350

10k+ parts

$0.340

4,665

$0.410

$0.370

$0.350

$0.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,248 parts In-Stock

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VNN

France . 2,837 parts In-Stock

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2,837

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 32,005 parts In-Stock

1+ parts

$0.348

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32,005

$0.348

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AZTECH Wire

Italy . 638 parts In-Stock

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$21.390

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638

$21.390

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LMD Electronica

Estonia . 7,780 parts In-Stock

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7,780

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NIA Electronics

USA . 5,584 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,521 parts In-Stock

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3,521

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Ledger Components

France . 3,377 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Montano Global Distributors

Canada . 1,344 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock endless possibilities with the 93LC66CT-I/ST by Microchip Technology, a top-tier EEPROM that guarantees reliability and superior performance. Designed to meet the highest industry standards, this memory IC offers seamless integration, fast operation, and long-lasting endurance for a wide range of applications. Trust in the quality and expertise of Microchip Technology to elevate your projects and bring innovation to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances the speed and efficiency of data transfer within the EEPROM.

Nominal Supply Voltage / Vsup (V): 3

A 3V supply voltage is commonly used in many electronic devices, making this EEPROM compatible with a wide range of applications.

No. of Terminals: 8

The 8 terminals allow for versatile connections and compatibility with various circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and longevity of the EEPROM.

Endurance: 1000000 Write/Erase Cycles

With a high endurance rating, this EEPROM can withstand frequent read/write operations, making it ideal for data-intensive applications.

Memory Density: 4096 bit

The high memory density enables storage of a large amount of data in a compact form factor, suitable for a variety of storage needs.

Technical Specifications

EEPROM 93LC66CT-I/ST attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO CONFIGURABLE AS 512 X 8

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

3 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Width:

3 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93LC66CT-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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