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93LC66BT-I/OT15KVAO

Microchip Technology

93LC66BT-I/OT15KVAO by Microchip Technology

Microchip Technology's 93LC66BT-I/OT15KVAO is a CMOS EEPROM with 256x16 organization, operating at 2MHz clock frequency. It has a memory density of 4096 bits and can endure up to 1M write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,451 parts In-Stock

1+ parts

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8,451

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VNN

France . 2,000 parts In-Stock

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2,000

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 440 parts In-Stock

1+ parts

$6.062

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440

$6.062

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Ampacity Inc.

Singapore . 1,238 parts In-Stock

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$11.000

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$11.000

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Perfect Parts

USA . 44,800 parts In-Stock

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44,800

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Cyclops Electronics Ltd (Excess)

UK . 20,000 parts In-Stock

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20,000

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XL Components Corporation

Australia . 6,048 parts In-Stock

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6,048

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Marpe Global Electronics

Taiwan . 4,059 parts In-Stock

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4,059

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Microchip USA

USA . 2,382 parts In-Stock

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QualityLine Systems

Poland . 1,622 parts In-Stock

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1,622

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of reliable data storage with the 93LC66BT-I/OT15KVAO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology guarantees top-notch quality and performance for its EEPROM products. This versatile memory IC type is perfect for a wide range of applications, providing customers with a secure and efficient solution for their data storage needs. With a high endurance of 1,000,000 write/erase cycles and a wide operating temperature range from -40°C to 85°C, this EEPROM offers exceptional value, benefits, and advantages that customers can rely on. Choose Microchip Technology for superior quality and reliability in data storage solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environments and applications.

Surface Mount: YES

Being surface mountable makes installation of the EEPROM easier and more convenient in modern electronic devices.

Operating Mode: SYNCHRONOUS

The synchronous operation allows for efficient communication with other components in the system, ensuring data integrity and reliability.

No. of Words: 256 words

With a decent memory capacity of 256 words, this EEPROM can store a significant amount of data for various applications.

Memory IC Type: EEPROM

Being an EEPROM (Electrically Erasable Programmable Read-Only Memory) ensures that data can be easily read, written, and erased as needed.

Technical Specifications

EEPROM 93LC66BT-I/OT15KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1.8V TO 2.5V @ 1MHz

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

5

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.55 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

93LC66BT-I/OT15KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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