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24VL014HT/MNY

Microchip Technology

24VL014HT/MNY by Microchip Technology

24VL014HT/MNY by Microchip Technology is an EEPROM with 128x8 organization, operating at 2.5V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for applications requiring low power consumption and reliable non-volatile memory storage in a compact form factor.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$0.550

-

-

-

VNN

France . 4,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,412

-

-

-

-

Vyrian

USA . 2,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,747 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

2,747

$0.520

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.550

100+ parts

$0.539

1k+ parts

-

10k+ parts

-

2,000

$0.550

$0.539

-

-

West Coast Incorporated

USA . 6,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,587

-

-

-

-

Overview

Unlock endless possibilities with the 24VL014HT/MNY EEPROM by Microchip Technology. Crafted with precision and reliability, this small yet powerful device offers seamless integration, fast data transfer, and secure storage solutions for your electronic projects. Whether you're designing smart appliances, IoT devices, or automotive systems, this versatile EEPROM ensures enhanced performance and durability. Experience the next level of innovation with the trusted quality of Microchip Technology. Elevate your designs and exceed customer expectations with the 24VL014HT/MNY.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic devices, saving time and effort during assembly.

Screening Level: TS 16949

This high screening level ensures top-quality performance and reliability, making this EEPROM a suitable option for critical applications where consistency is key.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, making it a practical choice for compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures precise and coordinated communication within the system, enhancing overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage offers a balance between power efficiency and performance, making this EEPROM suitable for a wide range of applications.

Power Supplies (V): 1.8/3.3

The multiple power supply options provide flexibility and compatibility with different systems, increasing the versatility of this EEPROM.

No. of Terminals: 8

With 8 terminals, this EEPROM offers robust connectivity options and ease of integration, making it a user-friendly choice for engineers.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal management and space efficiency, making this EEPROM ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance in challenging environmental conditions, making this EEPROM suitable for various applications.

Technical Specifications

EEPROM 24VL014HT/MNY attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1.5V TO 1.8V @ 0.1MHz

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

128X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3,3

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24VL014HT/MNY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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