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23K640T-E/ST

Microchip Technology

23K640T-E/ST by Microchip Technology

23K640T-E/ST by Microchip Technology is a 8Kx8 SRAM with 16MHz clock frequency, operating at -40 to 125°C. It has separate I/O, 3-state output, and serial interface. Ideal for automotive applications due to TS16949 screening level and low standby current of 0.00001A.

Median Price

$1.048

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.995

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-

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700

$0.995

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Vyrian

USA . 8,414 parts In-Stock

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8,414

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VNN

France . 4,114 parts In-Stock

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4,114

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ACDS - Activité Composants Distribution Service

France . 2,474 parts In-Stock

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2,474

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Bristol Electronics

USA . 2,474 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$0.616

10k+ parts

$0.581

2,474

-

$1.100

$0.616

$0.581

Dan-Mar Components

USA . 2,474 parts In-Stock

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2,474

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$1.135

100+ parts

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241

$1.135

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.215

100+ parts

$5.656

1k+ parts

$5.096

10k+ parts

-

2,000

$6.215

$5.656

$5.096

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$11.413

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198

$11.413

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QUARKTWIN TECHNOLOGY LTD

USA . 11,105 parts In-Stock

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Montano Global Distributors

Canada . 6,576 parts In-Stock

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Lixinc

USA . 6,058 parts In-Stock

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NIA Electronics

USA . 4,919 parts In-Stock

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4,919

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LOOK Integrated Logistics

Peru . 3,581 parts In-Stock

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3,581

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Ledger Components

France . 2,871 parts In-Stock

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2,871

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.975

1k+ parts

$0.945

10k+ parts

$0.925

1,000

-

$0.975

$0.945

$0.925

LMD Electronica

Estonia . 335 parts In-Stock

1+ parts

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335

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Overview

Experience unparalleled performance and reliability with the 23K640T-E/ST by Microchip Technology, a cutting-edge SRAM memory device designed to meet the highest industry standards. Perfect for automotive applications, this compact and versatile product boasts a nominal supply voltage of 3V and a maximum clock frequency of 16 MHz, ensuring optimal performance in demanding environments. With its advanced technology and seamless operation, this memory IC offers exceptional value and efficiency to customers looking for top-notch solutions in their designs. Trust in Microchip Technology to deliver quality and innovation you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material makes the product suitable for various applications

Surface Mount: YES

Allows for easy and convenient installation on PCBs

Operating Mode: SYNCHRONOUS

Enhances data transfer efficiency and synchronicity in operations

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for stable and efficient performance

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without risk of damage

Terminal Finish: MATTE TIN

Provides good electrical conductivity and corrosion resistance

Maximum Clock Frequency (fCLK): 16 MHz

High clock frequency enables rapid data processing

Technology: CMOS

Low power consumption and high noise immunity characteristics

Parallel or Serial: SERIAL

Serial communication allows for efficient data transfer within systems

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations occur

Technical Specifications

SRAM 23K640T-E/ST attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

16 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

23K640T-E/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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