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23K640-E/SN

Microchip Technology

23K640-E/SN by Microchip Technology

23K640-E/SN by Microchip Technology is a small outline SRAM with 8Kx8 organization, operating at up to 16 MHz. It has separate I/O type, operates synchronously at 3V, and features a max clock frequency of 16 MHz. Ideal for automotive applications due to its TS16949 screening level and low standby current of 0.00001 Amp.

Median Price

$0.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 611 parts In-Stock

1+ parts

$0.820

100+ parts

$0.812

1k+ parts

-

10k+ parts

-

611

$0.820

$0.812

-

-

Mouser Electronics

USA . 158 parts In-Stock

1+ parts

$0.880

100+ parts

$0.820

1k+ parts

-

10k+ parts

-

158

$0.880

$0.820

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.855

-

-

-

Vyrian

USA . 3,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,372

-

-

-

-

VNN

France . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,504 parts In-Stock

1+ parts

$0.700

100+ parts

-

1k+ parts

-

10k+ parts

-

3,504

$0.700

-

-

-

Continental Prestige Electronics

USA . 6,205 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

$0.838

6,205

$0.855

-

-

$0.838

Argo Parts USA

USA . 4,663 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

4,663

$0.855

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.855

-

-

-

Fulton Briggs Corp.

USA . 3,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,105

-

-

-

-

Overview

Elevate your designs with the high-quality 23K640-E/SN by Microchip Technology, a leading manufacturer in the industry. This innovative SRAM device offers unparalleled reliability and performance for a wide range of applications. With its small outline package and impressive features like synchronous operation and separate I/O type, this product delivers superior value and benefits to customers. Upgrade your projects with the cutting-edge technology of Microchip Technology's 23K640-E/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during production.

Screening Level: TS 16949

With a TS 16949 screening level, this product ensures high quality and reliability, meeting strict automotive industry standards.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space utilization on the PCB, making it suitable for compact designs.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode ensures accurate and synchronized data processing, making it ideal for real-time applications.

Input/Output Type: SEPARATE

Separate input/output type allows for independent data transfer, enhancing flexibility and efficiency in data communication.

Nominal Supply Voltage / Vsup: 3V

The 3V supply voltage ensures compatibility with a wide range of devices, making this product versatile and easy to integrate.

Power Supplies: 3/3.3V

With dual power supplies at 3V and 3.3V, this product offers flexibility in voltage selection based on specific application requirements.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile integration with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs with limited real estate.

Technical Specifications

SRAM 23K640-E/SN attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

16 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

23K640-E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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