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23K640T-I/ST

Microchip Technology

23K640T-I/ST by Microchip Technology

23K640T-I/ST by Microchip Technology is an 8Kx8 SRAM with a memory density of 65536 bit. It operates at a max clock frequency of 20 MHz and has a min standby voltage of 2.7 V. This industrial-grade memory IC is ideal for applications requiring fast synchronous operation in compact electronic devices.

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,500 parts In-Stock

1+ parts

$0.800

100+ parts

$0.740

1k+ parts

$0.700

10k+ parts

$0.660

7,500

$0.800

$0.740

$0.700

$0.660

Mouser Electronics

USA . 2,043 parts In-Stock

1+ parts

$0.860

100+ parts

$0.788

1k+ parts

-

10k+ parts

-

2,043

$0.860

$0.788

-

-

DigiKey

USA . 1,702 parts In-Stock

1+ parts

$0.860

100+ parts

-

1k+ parts

-

10k+ parts

$0.740

1,702

$0.860

-

-

$0.740

Master Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.070

10k+ parts

$0.680

2,500

-

-

$1.070

$0.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.742

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.742

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-

-

Vyrian

USA . 1,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,668

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-

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VNN

France . 430 parts In-Stock

1+ parts

-

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430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,439 parts In-Stock

1+ parts

$0.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,439

$0.700

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

$0.698

10k+ parts

-

50

$0.728

-

$0.698

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$4.171

100+ parts

-

1k+ parts

-

10k+ parts

-

117

$4.171

-

-

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$4.922

100+ parts

$4.479

1k+ parts

$4.036

10k+ parts

-

40

$4.922

$4.479

$4.036

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RGB Technical Solutions

Ukraine . 7,722 parts In-Stock

1+ parts

-

100+ parts

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7,722

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Lixinc

USA . 6,422 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,422

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

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A-Z Elektronik GmbH

Germany . 960 parts In-Stock

1+ parts

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100+ parts

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960

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Overview

Unlock seamless data storage and retrieval with the 23K640T-I/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability. This SRAM device is perfect for applications requiring fast and synchronous operation, offering customers unparalleled performance and efficiency. Trust in the innovative technology of Microchip Technology to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort.

Operating Mode: SYNCHRONOUS

Ensures accurate and synchronized data processing, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3

Compatible with a common voltage supply, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation in harsh environments.

No. of Words: 8192 words

Provides ample memory capacity for storing data and instructions.

Memory Density: 65536 bit

Offers high memory density for efficient data storage and retrieval.

Maximum Clock Frequency (fCLK): 20 MHz

Supports high-speed data processing, improving overall system performance.

Technical Specifications

SRAM 23K640T-I/ST attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

23K640T-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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