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23K256T-I/ST

Microchip Technology

23K256T-I/ST by Microchip Technology

23K256T-I/ST by Microchip Technology is a SRAM with 32KX8 organization, operating at 20 MHz clock frequency. It features separate I/O type, 3-STATE output characteristics, and operates in industrial temperature grade. Ideal for applications requiring high-speed synchronous memory with low power consumption.

Median Price

$1.405

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 117 parts In-Stock

1+ parts

$1.072

100+ parts

$1.044

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-

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117

$1.072

$1.044

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Mouser Electronics

USA . 7,330 parts In-Stock

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$1.470

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-

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$1.370

10k+ parts

$1.360

7,330

$1.470

-

$1.370

$1.360

DigiKey

USA . 7,694 parts In-Stock

1+ parts

$1.560

100+ parts

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$1.428

7,694

$1.560

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$1.428

Future Electronics

Canada . 2,500 parts In-Stock

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$1.340

2,500

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$1.340

Master Electronics

USA . 1,450 parts In-Stock

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$1.320

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$1.300

1,450

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$1.320

$1.300

Verical

USA . 750 parts In-Stock

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$1.635

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750

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$1.635

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$1.510

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550

$1.510

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NAC Semi

USA . 5,000 parts In-Stock

1+ parts

$1.570

100+ parts

$1.420

1k+ parts

$1.270

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5,000

$1.570

$1.420

$1.270

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Bristol Electronics

USA . 10,606 parts In-Stock

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10,606

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Atlantic Semiconductor

USA . 10,606 parts In-Stock

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10,606

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Sensible Micro Corp

USA . 8,474 parts In-Stock

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8,474

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IBS Electronics

USA . 6,450 parts In-Stock

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$1.851

10k+ parts

$1.823

6,450

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$1.851

$1.823

Vyrian

USA . 5,832 parts In-Stock

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5,832

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VNN

France . 3,847 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,484 parts In-Stock

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2,484

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ACDS - Activité Composants Distribution Service

France . 1,175 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,336 parts In-Stock

1+ parts

$1.040

100+ parts

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6,336

$1.040

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Semicontronic

India . 6,153 parts In-Stock

1+ parts

$1.040

100+ parts

$1.014

1k+ parts

$1.009

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6,153

$1.040

$1.014

$1.009

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Corohmni

South Africa . 1,011 parts In-Stock

1+ parts

$1.425

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1,011

$1.425

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Continental Prestige Electronics

USA . 1,351 parts In-Stock

1+ parts

$1.510

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$1.480

1,351

$1.510

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$1.480

Argo Parts USA

USA . 347 parts In-Stock

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$1.510

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347

$1.510

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.510

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$1.434

10k+ parts

$1.404

50

$1.510

-

$1.434

$1.404

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.682

100+ parts

$1.547

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$1.450

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2,000

$1.682

$1.547

$1.450

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Aztec Data Supply Inc.

USA . 3,677 parts In-Stock

1+ parts

$4.340

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3,677

$4.340

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Formix International (Excess)

India . 43,266 parts In-Stock

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Infinite Electronics LLP (Excess)

. 17,500 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 10,389 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 8,307 parts In-Stock

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Lixinc

USA . 7,860 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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$2.120

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Emar International I/E

Canada . 2,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,275 parts In-Stock

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1,275

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Glotronic Ltd.

UK . 940 parts In-Stock

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940

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Overview

Unlock unparalleled performance and reliability with the 23K256T-I/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality SRAM products that excel in various applications. This versatile memory solution boasts a wide range of benefits, including high-speed operation, low power consumption, and industrial-grade durability. Whether you're designing consumer electronics, automotive systems, or industrial controls, the 23K256T-I/ST provides unmatched value and performance for your projects. Elevate your designs with Microchip Technology's trusted expertise and cutting-edge technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - These materials provide durability and flexibility, making the product suitable for various applications.

Surface Mount:

YES - This feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Package Shape:

RECTANGULAR - The rectangular shape offers compatibility with standard board layouts, maximizing space efficiency.

Operating Mode:

SYNCHRONOUS - The synchronous operation ensures precise timing and coordination, resulting in reliable performance.

Input/Output Type:

SEPARATE - Separate input/output types allow for efficient data transfer and processing within the system.

Nominal Supply Voltage (Vsup):

3V - With a stable supply voltage of 3V, the product delivers consistent and reliable operation.

Power Supplies:

3/3.3V - Dual power supply options provide flexibility and compatibility with different voltage requirements.

No. of Terminals:

8 - The 8 terminals enable easy connectivity and integration with other components in the system.

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style offers compactness and space-saving benefits, ideal for space-constrained applications.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, the product can withstand harsh operating conditions.

Organization:

32KX8 - The 32KX8 organization allows for efficient data storage and retrieval, enhancing system performance.

Output Characteristics:

3-STATE - The 3-STATE output characteristics provide flexibility in controlling the output signal, enhancing versatility in applications.

Technical Specifications

SRAM 23K256T-I/ST attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

23K256T-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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