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23K256-I/P

Microchip Technology

23K256-I/P by Microchip Technology

23K256-I/P by Microchip Technology is a 32KX8 SRAM with a max clock frequency of 20 MHz. It operates at a nominal voltage of 3V and has a memory density of 262144 bit. This memory IC type is commonly used in industrial applications requiring high-speed data storage.

Median Price

$1.090

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 556 parts In-Stock

1+ parts

$0.247

100+ parts

-

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556

$0.247

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Newark

USA . 6 parts In-Stock

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$0.415

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$0.415

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-

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6

$0.415

$0.415

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RS (Exports)

UK . 34 parts In-Stock

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$0.420

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34

$0.420

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RS Americas

USA . 34 parts In-Stock

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$1.010

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34

$1.010

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Farnell

UK . 171 parts In-Stock

1+ parts

$1.090

100+ parts

$1.050

1k+ parts

$1.030

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-

171

$1.090

$1.050

$1.030

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Microchip Technology

USA . 9,910 parts In-Stock

1+ parts

$1.370

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$1.260

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$1.190

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$1.120

9,910

$1.370

$1.260

$1.190

$1.120

DigiKey

USA . 85 parts In-Stock

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$1.410

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85

$1.410

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Mouser Electronics

USA . 91 parts In-Stock

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$1.450

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$1.410

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91

$1.450

$1.410

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Element14

Singapore . 218 parts In-Stock

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$114.170

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$112.990

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$112.990

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Verical

USA . 556 parts In-Stock

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556

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.290

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50

$1.290

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NAC Semi

USA . 7,920 parts In-Stock

1+ parts

$1.550

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$1.400

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$1.260

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$1.550

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VNN

France . 25,278 parts In-Stock

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Vyrian

USA . 7,199 parts In-Stock

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Semi Source

USA . 50 parts In-Stock

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Ashlea Components Ltd

UK . 33 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 252 parts In-Stock

1+ parts

$0.974

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252

$0.974

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Allen Electronics Distributors

USA . 34 parts In-Stock

1+ parts

$3.020

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34

$3.020

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RGB Technical Solutions

Ukraine . 2,982 parts In-Stock

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2,982

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Overview

Experience the unparalleled quality and reliability of Microchip Technology with the 23K256-I/P SRAM. As a leader in the industry, Microchip delivers cutting-edge solutions for all your memory needs. This versatile product is perfect for a wide range of applications, offering seamless operation and high-performance results. With a compact design and advanced features, the 23K256-I/P provides exceptional value, ensuring that you get the most out of your investment. Trust Microchip Technology to deliver superior products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the SRAM, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise and coordinated data transfers, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, ensuring compatibility with most systems.

Organization: 32KX8

Offers a high organization capacity, allowing for efficient storage and retrieval of data.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making it energy efficient.

Maximum Clock Frequency (fCLK): 20 MHz

Supports high clock frequencies, enabling fast data processing and transfer speeds.

Technical Specifications

SRAM 23K256-I/P attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

23K256-I/P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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