Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Maximum Supply Voltage (Vsup): 5.5 V; Nominal Supply Voltage / Vsup (V): 5; Memory Density: 262144 bit;
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Other Function Memory ICs DS6417P-256 attributes and parameters. Explore more Other Function Memory ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
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No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
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Maximum Supply Voltage (Vsup):
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DS6417P-256 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
1N4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Semiconductor Technology
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
STM32H750VBT6
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20+
Analog Devices
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SM4461-15JDS
Texas Instruments
SM4461-15JDS by Texas Instruments is a 64KX4 VIDEO DRAM IC with 262144 bit memory density. It operates at 5V, has 24 terminals in an IN-LINE package style, and offers a max access time of 150 ns. Ideal for applications requiring high-speed video data processing in temperature ranges from -55 to 110°C.
SSDSC2BB480G7
Intel
MEMORY CIRCUIT;
MR2A16AYS35R
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
MR25H256CDF
MR25H256CDF by Everspin Technologies is a 32KX8 memory IC with CMOS technology. Operating at 3V, it has a temperature range of -40 to 85 °C and offers 262144 bits memory density. Ideal for industrial applications, this synchronous memory chip comes in a small outline package with surface mount capability.
DS9093RB+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; Terminal Finish: Matte Tin (Sn) - annealed; Technology: CMOS; Qualification: Not Qualified;
M36W0R6030T0ZAQE
M36W0R6030T0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM technologies for efficient data storage in industrial applications. With a max temp of 85 °C and access time of 70ns, it ensures reliable performance.
CY7C245A-18WMB
Teledyne E2v (Uk)
Other Memory ICs;
M36W108B120ZM6T
STMicroelectronics M36W108B120ZM6T is a 1MX8 memory IC with 8388608 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and supports asynchronous mode. With low profile grid array package, it's ideal for applications requiring high-speed data storage and retrieval.
M36LLR8860D1ZAQF
M36LLR8860D1ZAQF by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates efficiently at temperatures from -25 °C to 85 °C and supports surface mount applications. Ideal for compact devices, it offers high-density storage in a small footprint.
TMS27P64N25
NMC27C16QE-45
NMC27C16QE-45 by Texas Instruments is a 2Kx8 OTP ROM memory IC with 16384-bit density. It operates at a max access time of 450ns and has an industrial temperature grade range from -40°C to 85°C. This CMOS technology device features a common I/O type, 3-state output characteristics, and is commonly used in applications requiring non-volatile memory storage.
EPCQ128ASI16N
EPCQ128ASI16N by Intel is a 16MX8 NOR type memory IC with 3-STATE output, operating at up to 100 MHz clock frequency. It features a small outline package style, suitable for industrial applications requiring high-speed synchronous operation and a memory density of 134217728 bits.
TMS27C32-10NE4
TMS27C32-15NE
CC2544RHBR
The Texas Instruments CC2544RHBR is a memory circuit IC with a clock frequency of 2496 MHz, operating temperature range of -40 to 125°C, and supply voltage from 2V to 3.6V. It is designed for automotive applications in a square chip carrier package style suitable for surface mount assembly.
CY15B104QSN-108SXIES
Infineon Technologies
CY15B104QSN-108SXIES by Infineon Technologies is a 512Kx8 memory IC with synchronous operation. It has a memory density of 4,194,304 bits and operates at a nominal voltage of 3V. This small outline package is ideal for industrial applications requiring reliable memory storage in compact spaces.
DS1992L-F5+
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; JESD-30 Code: O-MEDB-N2; Maximum Supply Voltage (Vsup): 6 V;
TMX27PC128N30
M36W0R6040B0ZAQ
M36W0R6040B0ZAQ by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and PSRAM in a compact 88-terminal grid array package. Ideal for applications requiring efficient asynchronous access with low power consumption.
DS2401-SL+T&R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Memory Density: 64 bit;
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DS6417-004
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified;
DS6417-001
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Organization: 128KX8; Terminal Finish: TIN LEAD;
DS6417P-001
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Functions: 1; Terminal Finish: TIN LEAD;
DS6417-002
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; No. of Functions: 1; Nominal Supply Voltage / Vsup (V): 5; Surface Mount: NO;
DS6417P-004
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Surface Mount: NO; Maximum Operating Temperature: 70 Cel; JESD-30 Code: X-XXMA-X;
DS6417P-002
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.5 V; Memory Density: 2097152 bit;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; JESD-609 Code: e0; JESD-30 Code: X-XXMA-X; Qualification: Not Qualified;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Technology: CMOS; Operating Mode: SYNCHRONOUS; Minimum Operating Temperature: 0 Cel;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Maximum Supply Voltage (Vsup): 5.5 V; Surface Mount: NO; Terminal Finish: TIN LEAD;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Surface Mount: NO; Memory Density: 2097152 bit; Qualification: Not Qualified;
DS6417-256
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Technology: CMOS; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
DS6417P-512
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Memory Density: 524288 bit; Maximum Supply Voltage (Vsup): 5.5 V; Maximum Operating Temperature: 70 Cel;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Minimum Operating Temperature: 0 Cel; Memory Density: 4194304 bit; No. of Functions: 1;
DS6417-512
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; No. of Functions: 1; Qualification: Not Qualified; Memory Width: 8;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Organization: 128KX8; Terminal Finish: TIN LEAD; Maximum Supply Voltage (Vsup): 5.5 V;
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; No. of Words Code: 128K; Qualification: Not Qualified;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Maximum Supply Voltage (Vsup): 5.5 V; JESD-30 Code: X-XXMA-X; Nominal Supply Voltage / Vsup (V): 5;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Terminal Position: UNSPECIFIED; Technology: CMOS; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
DS6417P-256
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Qualification: Not Qualified; JESD-30 Code: X-XXMA-X; Memory Width: 8;
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Memory Width: 8; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified;
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