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MD27011-30

Intel

MD27011-30 by Intel

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 444 parts In-Stock

1+ parts

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100+ parts

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444

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Digiode

USA . 325 parts In-Stock

1+ parts

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325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 4,623 parts In-Stock

1+ parts

$1.776

100+ parts

-

1k+ parts

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10k+ parts

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4,623

$1.776

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Texas Native Microelectronics

USA . 199 parts In-Stock

1+ parts

$2.041

100+ parts

$1.959

1k+ parts

$1.898

10k+ parts

$1.796

199

$2.041

$1.959

$1.898

$1.796

Kenton Components

USA . 50 parts In-Stock

1+ parts

$2.449

100+ parts

-

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10k+ parts

$2.155

50

$2.449

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$2.155

Qasali Group International

UK . 450 parts In-Stock

1+ parts

$5.511

100+ parts

-

1k+ parts

$5.125

10k+ parts

$4.849

450

$5.511

-

$5.125

$4.849

Corphita

USA . 147 parts In-Stock

1+ parts

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147

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Technical Specifications

EPROM MD27011-30 attributes and parameters. Explore more EPROM devices from Intel

Specs

Maximum Access Time:

300 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

JESD-609 Code:

e0

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

131072 words

No. of Words Code:

128K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

EPROMs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MD27011-30 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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