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EPC1441TC32

Intel

EPC1441TC32 by Intel

CONFIGURATION MEMORY; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Surface Mount: YES; JESD-609 Code: e0;

Median Price

$3.500

Lifecycle Status

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7

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Arrow

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Digiode

USA . 1,234 parts In-Stock

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Vyrian

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Resion

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Sogenti Electronics

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MARBEL Systems

Belgium . 565 parts In-Stock

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Texas Native Microelectronics

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$2.344

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$2.250

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$2.180

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$2.063

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Kenton Components

USA . 878 parts In-Stock

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One Stop Electronics

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Semicontronic

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$2.906

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Corphita

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Corohmni

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Modulus Dynamics

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Qasali Group International

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Microchip USA

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Glotronic Ltd.

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Technical Specifications

EPROM EPC1441TC32 attributes and parameters. Explore more EPROM devices from Intel

Specs

Additional Features:

IT ALSO REQUIRES 5V NOMINAL SUPPLY

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Memory Density:

440800 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

440800 words

No. of Words Code:

440800

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

440800X1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3.3/5

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00006 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

EPC1441TC32 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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