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5SGXEABK2H40C2LN

Intel

5SGXEABK2H40C2LN by Intel

Intel's 5SGXEABK2H40C2LN FPGA boasts 952,000 logic cells and 35,920 CLBs. Operating at a max voltage of 0.88V, it offers 696 inputs/outputs for versatile applications in CMOS technology. With a compact square package style and grid array form, it suits various projects requiring high-performance programmable ICs.

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Overview

Unlock limitless possibilities with the 5SGXEABK2H40C2LN by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that offers unparalleled quality and performance. Manufactured by industry leader Intel, this FPGA boasts 952,000 logic cells and 35,920 CLBs, making it ideal for a wide range of applications. With its advanced CMOS technology and versatile package style, this FPGA provides customers with a powerful and flexible solution for their design needs. Experience the value and benefits of Intel's top-of-the-line FPGA, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for various applications.

No. of Logic Cells: 952000

With a large number of logic cells, this FPGA allows for complex and high-performance designs to be implemented efficiently.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for easier integration into electronic systems.

Maximum Supply Voltage: 0.88 V

The low maximum supply voltage helps in reducing power consumption and heat generation in the FPGA.

No. of CLBs: 35920

Having a high number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and faster operation speed.

No. of Inputs: 696

A large number of inputs allows for interfacing with multiple external devices and signals, enhancing the versatility of the FPGA.

Package Shape: SQUARE

The square package shape makes the FPGA easy to handle and install, optimizing space utilization on circuit boards.

Form Of Terminal: BALL

The ball terminal form simplifies the soldering process and ensures reliable electrical connections for improved performance.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85V offers stable operation and compatibility with a wide range of power supplies.

Power Supplies (V): 0.85, 1.5, 2.5, 2.5/3, 1.2/3

Having multiple power supply options allows for flexibility in design and compatibility with diverse system requirements.

No. of Terminals: 1517

A high number of terminals enables efficient connectivity and signal routing within the FPGA, enhancing overall performance.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this product offers reconfigurability and adaptability to changing design requirements without the need for hardware changes.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient heat dissipation and simplifies the manufacturing and assembly processes.

Minimum Supply Voltage: 0.82 V

The low minimum supply voltage ensures stable operation with minimal power consumption, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can operate reliably in a wide range of environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch allows for compact and efficient PCB layout, reducing signal interference and optimizing signal integrity.

Organization: 35920 CLBS

With an organizational structure of 35920 Configurable Logic Blocks (CLBs), this FPGA provides a versatile platform for complex digital designs.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures functionality in varied operating environments.

Position Of Terminal: BOTTOM

The bottom position of the terminal simplifies PCB design and assembly, resulting in a more compact and efficient overall system.

Maximum Seated Height: 3.9 mm

The low maximum seated height allows for slim and space-efficient device designs, reducing the overall footprint of the system.

Width: 45 mm

The 45mm width provides a compact form factor, making it suitable for applications where space is limited.

No. of Outputs: 696

The high number of outputs allows for versatile signal processing and interfacing capabilities, enhancing the functionality of the FPGA.

Length: 45 mm

The 45mm length contributes to the overall compactness of the FPGA, enabling space-efficient integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5SGXEABK2H40C2LN attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

952000

No. of Inputs:

696

No. of Outputs:

696

No. of CLBs:

35920

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

35920 CLBS

Power Characteristics

Nominal Supply Voltage:

.85

Minimum Supply Voltage:

.82 V

Maximum Supply Voltage:

.88 V

Power Supplies:

0.85,1.5,2.5,2.5/3,1.2/3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

3.9 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

Qualified:

No

Trade Compliance

5SGXEABK2H40C2LN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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