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5SGXEA5N2F45I2N

Intel

5SGXEA5N2F45I2N by Intel

Intel's 5SGXEA5N2F45I2N FPGA boasts 490,000 logic cells and 18,500 CLBs. With a max supply voltage of 0.93V, it is ideal for industrial applications requiring high-performance CMOS technology. This square-shaped FPGA features 840 inputs/outputs and operates b/w -40 to 100°C.

Median Price

$2,650.000

Lifecycle Status

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Vyrian

USA . 991 parts In-Stock

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Digiode

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Chip Stock

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Flip Electronics

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Nova Conductors

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Semicontronic

India . 873 parts In-Stock

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$7.800

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$7.760

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Ampacity Inc.

Singapore . 781 parts In-Stock

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One Stop Electronics

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MARBEL Systems

Belgium . 1,765 parts In-Stock

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Kenton Components

USA . 44 parts In-Stock

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Modulus Dynamics

Lithuania . 235 parts In-Stock

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$69.060

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Corohmni

South Africa . 206 parts In-Stock

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Texas Native Microelectronics

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Qasali Group International

UK . 5,532 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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Supply Digital

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Corphita

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Overview

Unlock endless possibilities with the Intel 5SGXEA5N2F45I2N Field Programmable Gate Array (FPGA). Crafted by a leading manufacturer, this FPGA boasts top-notch quality and reliability. Perfect for a wide range of applications, from industrial automation to telecommunications, this FPGA offers unparalleled flexibility and customization. Experience the power of 490,000 logic cells and 18,500 CLBs without compromising on efficiency. Elevate your projects with the Intel 5SGXEA5N2F45I2N FPGA and redefine what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 490000

High number of logic cells allow for complex logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount technology simplifies the PCB assembly process and saves space on the board.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

No. of CLBs: 18500

Large number of Configurable Logic Blocks (CLBs) provide flexibility in implementing various logic functions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-operated devices.

No. of Inputs: 840

Ample number of input pins support connectivity with a wide range of external devices.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Form Of Terminal: BALL

Ball terminal shape eases the process of soldering and provides a reliable electrical connection.

Nominal Supply Voltage (V): 0.9

Low nominal supply voltage ensures compatibility with low-power circuits and extends battery life.

Power Supplies (V): 0.9,1.5,2.5,2.5/3,1.2/3

Multiple power supply options enable the FPGA to be used in diverse applications with varying voltage requirements.

No. of Terminals: 1932

High number of terminals facilitate connectivity with external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA), it provides flexibility in designing and reconfiguring custom logic functions.

Package Style (Meter): GRID ARRAY

Grid array package style offers better mechanical stability and thermal performance.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 100 °C

Wide operating temperature range makes the FPGA suitable for industrial applications where temperature variations are common.

Pitch Of Terminal: 1 mm

1mm terminal pitch allows for high-density mounting on the PCB, saving space and facilitating routing.

Organization: 18500 CLBS

Organized into 18500 Configurable Logic Blocks (CLBs), providing a structured and scalable logic architecture.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the FPGA can withstand harsh environmental conditions in industrial settings.

Position Of Terminal: BOTTOM

Bottom position of terminals simplifies PCB layout and routing, improving signal integrity.

Maximum Seated Height: 3.9 mm

Low maximum seated height allows for slim and compact designs in space-constrained applications.

Width: 45 mm

Compact width of 45mm ensures the FPGA can fit into tight spaces without compromising functionality.

No. of Outputs: 840

Ample number of output pins support driving signals to a variety of external components and interfaces.

Length: 45 mm

Square dimensions with a length of 45mm enable a symmetrical layout on the PCB, improving signal integrity.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures reliable operation in harsh environmental conditions typically found in industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5SGXEA5N2F45I2N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

490000

No. of Inputs:

840

No. of Outputs:

840

No. of CLBs:

18500

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

18500 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.5,2.5,2.5/3,1.2/3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

3.9 mm

Package Equivalence Code:

BGA1932,44X44,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1932

Qualified:

No

Trade Compliance

5SGXEA5N2F45I2N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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