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5SGXMA3H2F35C3N

Intel

5SGXMA3H2F35C3N by Intel

Intel's 5SGXMA3H2F35C3N FPGA boasts 340K logic cells, 12830 CLBs, and 432 inputs/outputs. Ideal for applications requiring high-speed processing in compact spaces with a max operating temperature of 85°C.

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Overview

Unlock limitless possibilities with the Intel 5SGXMA3H2F35C3N Field Programmable Gate Array. Crafted with precision by Intel, this FPGA boasts superior quality and cutting-edge technology. Ideal for a wide range of applications, this versatile device offers unmatched flexibility and performance. Experience the value and benefits of this innovative product as it empowers you to push boundaries and achieve your goals with ease. Elevate your projects to new heights with the Intel 5SGXMA3H2F35C3N FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the FPGA lightweight and durable, perfect for portable or rugged applications.

No. of Logic Cells: 340000

With a large number of logic cells, this FPGA can handle complex designs and computations efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA into PCB designs, saving space and allowing for more compact devices.

Maximum Supply Voltage: 0.88 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

Package Shape: SQUARE

The square shape simplifies the PCB layout and allows for efficient use of space within the design.

Nominal Supply Voltage (V): 0.85

The low nominal supply voltage contributes to the energy efficiency of the product, reducing operating costs and extending battery life.

No. of Terminals: 1152

With a high number of terminals, this FPGA provides ample connectivity options for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility in design changes and quick prototyping, making it suitable for iterative development processes.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environments with elevated temperatures.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5SGXMA3H2F35C3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

340000

No. of Inputs:

432

No. of Outputs:

432

No. of CLBs:

12830

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

12830 CLBS

Power Characteristics

Nominal Supply Voltage:

.85

Minimum Supply Voltage:

.82 V

Maximum Supply Voltage:

.88 V

Power Supplies:

0.85,1.5,2.5,2.5/3,1.2/3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.6 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Qualified:

No

Trade Compliance

5SGXMA3H2F35C3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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