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5SGXEA7N2F45C2

Intel

5SGXEA7N2F45C2 by Intel

Intel's 5SGXEA7N2F45C2 FPGA boasts 622,000 logic cells and 23,472 CLBs. With a max supply voltage of 0.93V, it offers 840 inputs/outputs for versatile applications in various industries like telecommunications and automotive due to its advanced CMOS technology.

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Overview

Unlock limitless possibilities with the Intel 5SGXEA7N2F45C2 Field Programmable Gate Array (FPGA). With over 600,000 logic cells and 23,472 CLBs, this cutting-edge technology offers unparalleled flexibility and customization for a wide range of applications. Intel's reputation for quality and innovation ensures that you're getting a reliable and high-performance product. From advanced data processing to complex algorithm implementation, the 5SGXEA7N2F45C2 delivers unmatched value and benefits to customers seeking top-tier performance in their projects. Upgrade your capabilities today with Intel FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

No. of Logic Cells: 622000

With a high number of logic cells, this FPGA can handle complex logic functions efficiently.

Surface Mount: YES

Surface mount technology makes it easy to integrate this FPGA onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.93 V

Operating at a low voltage can help reduce power consumption and heat generation in the system.

No. of CLBs: 23472

A large number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing various logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the FPGA reliable and efficient.

No. of Inputs: 840

Having a high number of inputs enables the FPGA to interface with multiple external devices or sensors.

Package Shape: SQUARE

A square package shape allows for easier handling and integration into circuit designs with a symmetrical layout.

Form Of Terminal: BALL

Ball terminals provide secure connections and allow for easy soldering onto circuit boards.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V ensures stable and reliable operation of the FPGA within specified voltage limits.

Power Supplies (V): 0.85,1.5,2.5,2.5/3,1.2/3

Multiple power supply options give flexibility in designing power distribution for different sections of the FPGA and meeting specific power requirements.

No. of Terminals: 1932

Having a high number of terminals allows for more connectivity options and enables integration into complex circuit layouts.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers reconfigurability and flexibility in designing custom logic functions without the need for dedicated hardware.

Package Style (Meter): GRID ARRAY

A grid array package style provides secure mounting and easy alignment during assembly, ensuring proper connections and reliability.

Minimum Supply Voltage: 0.87 V

Having a low minimum supply voltage allows for operation in a wide range of voltage conditions and ensures stability during voltage fluctuations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperature environments and maintain performance under thermal stress.

Pitch Of Terminal: 1 mm

A terminal pitch of 1mm provides sufficient spacing for soldering and ensures proper alignment during assembly, reducing the risk of short circuits.

Organization: 23472 CLBS

Organizing the FPGA into 23472 Configurable Logic Blocks (CLBs) allows for efficient utilization of logic resources and simplifies the design process.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function reliably in cold environments without performance degradation.

Position Of Terminal: BOTTOM

Bottom-positioned terminals make it easier to connect the FPGA to other components on the circuit board and provide a more compact layout.

Maximum Seated Height: 3.9 mm

A maximum seated height of 3.9mm allows for a compact design profile, making this FPGA suitable for applications with limited space constraints.

Width: 45 mm

The width of 45mm provides a balance between compactness and connectivity, allowing for easy integration into standard circuit board layouts.

No. of Outputs: 840

Having a high number of outputs enables the FPGA to drive multiple devices or interfaces, expanding the range of applications it can support.

Length: 45 mm

The length of 45mm complements the width and seated height, providing a well-proportioned package size for efficient circuit board integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5SGXEA7N2F45C2 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

622000

No. of Inputs:

840

No. of Outputs:

840

No. of CLBs:

23472

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

23472 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.85,1.5,2.5,2.5/3,1.2/3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

3.9 mm

Package Equivalence Code:

BGA1932,44X44,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1932

Qualified:

No

Trade Compliance

5SGXEA7N2F45C2 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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