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10AS032H3F35E2LG

Intel

10AS032H3F35E2LG by Intel

SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

Median Price

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,314 parts In-Stock

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Chip Stock

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Digiode

USA . 731 parts In-Stock

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Northwest PG Solutions

USA . 2,204 parts In-Stock

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$2.885

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Ampacity Inc.

Singapore . 280 parts In-Stock

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$6.000

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One Stop Electronics

USA . 1,238 parts In-Stock

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$14.000

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MARBEL Systems

Belgium . 1,888 parts In-Stock

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Texas Native Microelectronics

USA . 4,094 parts In-Stock

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$22.271

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$20.712

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$19.598

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Kenton Components

USA . 524 parts In-Stock

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$26.725

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$23.518

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Modulus Dynamics

Lithuania . 1,576 parts In-Stock

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$27.922

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$27.922

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Semicontronic

India . 411 parts In-Stock

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$35.000

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$34.125

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$33.950

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Qasali Group International

UK . 2,196 parts In-Stock

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$60.132

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Vigor

Singapore . 378 parts In-Stock

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Microchip USA

USA . 2,365 parts In-Stock

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Supply Digital

USA . 2,315 parts In-Stock

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Corphita

USA . 839 parts In-Stock

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Native Components

USA . 265 parts In-Stock

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$2.544

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Corohmni

South Africa . 105 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs 10AS032H3F35E2LG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

Additional Features:

ALSO OPERATES AT 0.95V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.35 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

TSMC

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

SoC

Trade Compliance

10AS032H3F35E2LG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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