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IS25WP064A-RMLE-TR

Integrated Silicon Solution

IS25WP064A-RMLE-TR by Integrated Silicon Solution

IS25WP064A-RMLE-TR by Integrated Silicon Solution is a 64Mb Flash Memory with 8MX8 organization, operating at up to 133MHz clock frequency. It has a small outline package style and is suitable for industrial temperature grade applications. With synchronous operation and serial interface, it offers high memory density of 67108864 bits for various embedded systems.

Median Price

$1.498

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$1.498

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10

$1.498

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Vyrian

USA . 6,909 parts In-Stock

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6,909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,519 parts In-Stock

1+ parts

$1.498

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2,519

$1.498

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Netroflash

USA . 2,000 parts In-Stock

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$1.498

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2,000

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Continental Prestige Electronics

USA . 435 parts In-Stock

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$1.498

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$1.468

435

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$1.468

Corohmni

South Africa . 822 parts In-Stock

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$2.423

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822

$2.423

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Aztec Data Supply Inc.

USA . 83 parts In-Stock

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$4.080

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83

$4.080

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AZTECH Wire

Italy . 247 parts In-Stock

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$11.228

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QUARKTWIN TECHNOLOGY LTD

USA . 27,585 parts In-Stock

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Overview

Unlock the power of reliable and high-performance flash memory with the IS25WP064A-RMLE-TR from Integrated Silicon Solution. Designed with top-quality materials and advanced technology, this memory module delivers seamless operation and fast data transfer speeds. Perfect for industrial applications, this compact and efficient product offers customers unmatched value and convenience. Trust in ISS to provide you with the superior memory solution you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the longevity and reliability of the flash memory.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates and improved efficiency.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency enables quick access to stored data, enhancing overall performance.

Memory Density: 67108864 bit

High memory density allows for storing a large amount of data in a compact form factor.

Technical Specifications

Flash Memory IS25WP064A-RMLE-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

1.8

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

IS25WP064A-RMLE-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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