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IS25WP064A-RHLE

Integrated Silicon Solution

IS25WP064A-RHLE by Integrated Silicon Solution

IS25WP064A-RHLE by Integrated Silicon Solution is an 8MX8 NOR Flash Memory with 133 MHz clock frequency. Operating at -40 to 105 °C, it offers 100000 Write/Erase cycles and SPI serial bus type for industrial applications.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 469 parts In-Stock

1+ parts

$2.420

100+ parts

$2.200

1k+ parts

-

10k+ parts

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469

$2.420

$2.200

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-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.659

10k+ parts

-

480

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-

$2.659

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.623

100+ parts

-

1k+ parts

-

10k+ parts

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500

$1.623

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-

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NAC Semi

USA . 2,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.720

10k+ parts

$1.590

2,640

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-

$1.720

$1.590

Vyrian

USA . 1,184 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,145 parts In-Stock

1+ parts

$1.623

100+ parts

-

1k+ parts

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10k+ parts

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3,145

$1.623

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Continental Prestige Electronics

USA . 911 parts In-Stock

1+ parts

$1.623

100+ parts

-

1k+ parts

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10k+ parts

$1.591

911

$1.623

-

-

$1.591

Corohmni

South Africa . 12 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

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12

$1.683

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Aztec Data Supply Inc.

USA . 3,651 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

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10k+ parts

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3,651

$2.770

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Authorized Procurement Solutions

USA . 3,120 parts In-Stock

1+ parts

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3,120

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Perfect Parts

USA . 28 parts In-Stock

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28

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Overview

Unlock the power of high-quality flash memory with the IS25WP064A-RHLE by Integrated Silicon Solution. Manufactured with precision and expertise, this versatile product offers a wide range of applications in various industries. With its durable construction and reliable performance, customers can trust that their data is safe and secure. Experience seamless operation and fast data transfer speeds with this innovative solution. Upgrade your technology with the IS25WP064A-RHLE and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material ensures durability and reliability of the flash memory chip.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster and more efficient data transfer.

Nominal Supply Voltage: 1.8V

Low nominal supply voltage helps in reducing power consumption and extending battery life in devices.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and ensures long-lasting performance of the flash memory chip.

Memory Density: 67108864 bit

High memory density allows for storing large amounts of data in a compact chip size.

Endurance: 100000 Write/Erase Cycles

High endurance rating means the flash memory chip can withstand frequent read/write operations without degradation.

Memory IC Type: FLASH

Being a Flash memory IC type, this product offers non-volatile storage and fast access times, making it ideal for data storage applications.

Technical Specifications

Flash Memory IS25WP064A-RHLE attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PBGA-B24

JESD-609 Code:

e1

Length:

5 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000035 Amp

Maximum Supply Current:

29 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

10

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

IS25WP064A-RHLE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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