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IS25LQ025B-JNLE-TR

Integrated Silicon Solution

IS25LQ025B-JNLE-TR by Integrated Silicon Solution

IS25LQ025B-JNLE-TR by Integrated Silicon Solution is a 256Kx1 Flash Memory with synchronous operation at up to 104MHz. It has a small outline package, operates in industrial temperature range (-40°C to 105°C), and supports serial communication. Ideal for applications requiring high-speed data storage in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,196 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Corohmni

South Africa . 73 parts In-Stock

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$2.521

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73

$2.521

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Aztec Data Supply Inc.

USA . 96 parts In-Stock

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$4.800

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96

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AZTECH Wire

Italy . 752 parts In-Stock

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$17.193

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Lixinc

USA . 6,937 parts In-Stock

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Continental Prestige Electronics

USA . 5,804 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 934 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unlock the power of reliable and efficient data storage with IS25LQ025B-JNLE-TR by Integrated Silicon Solution. Built with top-of-the-line technology, this flash memory device offers unparalleled performance in a compact design. From industrial applications to consumer electronics, this product boasts a wide range of uses, making it a versatile solution for all your memory needs. Trust in the quality and expertise of Integrated Silicon Solution to deliver a product that exceeds expectations and provides value that you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Operating Mode: SYNCHRONOUS

Provides efficient and synchronized operation for data transfers.

Nominal Supply Voltage / Vsup (V): 3

Ensures compatibility with standard voltage requirements.

Maximum Operating Temperature: 105 °C

Allows for reliable performance in high temperature environments.

Memory IC Type: FLASH

Offers fast and reliable data storage and retrieval capabilities.

Technical Specifications

Flash Memory IS25LQ025B-JNLE-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

IS25LQ025B-JNLE-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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